Inventor · disambiguated record

Chung-Hwa Feng

Also filed as: FENG CHUNG-HWA

1 granted patent·6 citations·filing 2005–2005

27Inventor score

Technology areasH05K

Files withADVANCED SEMICONDUCTOR ENG1

Top patents by PatentIndex Score

1 record

0168US7726544B2Method of packaging flip chip and method of forming pre-solders on substrate thereofADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Jun 1, 2010·6 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →