Inventor · disambiguated record

Tomoya Shimonaka

Also filed as: SHIMONAKA TOMOYA

1 granted patent·1 pending application·5 citations·filing 2005–2008

28Inventor score

Technology areasH10W

Files withSHIMONAKA TOMOYA1 TOWA CORP1

Top patents by PatentIndex Score

2 records

0165US7439101B2Resin encapsulation molding method for semiconductor deviceTOWA CORP·Filed 2005·Granted Oct 21, 2008·5 cites·4 claims
0235US2008213947A1Resin encapsulation molding method for semiconductor deviceSHIMONAKA TOMOYA·Filed 2008·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →