Inventor · disambiguated record
Gi Bon Cha
Also filed as: CHA GI B · CHA GI-BON
11 granted patents·860 citations·filing 1992–2001
93Inventor score
Top patents by PatentIndex Score
11 records- 0196US5444301ASemiconductor package and method for manufacturing the sameGOLD STAR ELECTRONICS·Filed 1994·Granted Aug 22, 1995·302 cites·8 claims
- 0296US5428248AResin molded semiconductor packageGOLD STAR ELECTRONICS·Filed 1994·Granted Jun 27, 1995·292 cites·10 claims
- 0396US5363279ASemiconductor package for a semiconductor chip having centrally located bottom bond padsGOLD STAR ELECTRONICS·Filed 1992·Granted Nov 8, 1994·107 cites·6 claims
- 0480US6242798B1Stacked bottom lead package in semiconductor devicesHYUNDAI ELECTRONICS IND·Filed 2000·Granted Jun 5, 2001·27 cites·14 claims
- 0572US5854740AElectronic circuit board with semiconductor chip mounted thereon, and manufacturing method thereforLG SEMICON CO LTD·Filed 1996·Granted Dec 29, 1998·44 cites·23 claims
- 0667US6030858AStacked bottom lead package in semiconductor devices and fabricating method thereofLG SEMICON CO LTD·Filed 1997·Granted Feb 29, 2000·30 cites·7 claims
- 0763US5861668ASemiconductor packageLG SEMICON CO LTD·Filed 1997·Granted Jan 19, 1999·30 cites·23 claims
- 0857US6399420B2Ultra high density integrated circuit BLP stack and method for fabricating the sameLG SEMICON CO LTD·Filed 2001·Granted Jun 4, 2002·10 cites·3 claims
- 0946US5334873ASemiconductor packages with centrally located electrode padsGOLD STAR ELECTRONICS·Filed 1992·Granted Aug 2, 1994·16 cites·7 claims
- 1032USRE37413ESemiconductor package for a semiconductor chip having centrally located bottom bond padsHYUNDAI ELECTRONICS IND·Filed 1998·Granted Oct 16, 2001·2 cites·43 claims
- 1129USRE36097ESemiconductor package for a semiconductor chip having centrally located bottom bond padsLG SEMICON LTD·Filed 1996·Granted Feb 16, 1999·0 cites·6 claims
Join the waitlist — get patent alerts
Get an alert when Gi Bon Cha files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →