Inventor · disambiguated record
Yuuhei Okada
Also filed as: OKADA YUUHEI
7 granted patents·2 pending applications·6 citations·filing 2010–2024
74Inventor score
Top patents by PatentIndex Score
9 records- 0169US2025083262A1Solder particles and method for producing solder particlesRESONAC CORP·Filed 2024·Application pending·0 cites
- 0268US8859429B2Polishing agent for copper polishing and polishing method using sameONO HIROSHI·Filed 2012·Granted Oct 14, 2014·2 cites·43 claims
- 0366US8889555B2Polishing agent for copper polishing and polishing method using sameONO HIROSHI·Filed 2010·Granted Nov 18, 2014·2 cites·34 claims
- 0465US12172240B2Solder particlesSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Dec 24, 2024·0 cites·11 claims
- 0563US10796921B2CMP fluid and method for polishing palladiumMINAMI HISATAKA·Filed 2010·Granted Oct 6, 2020·2 cites·18 claims
- 0656US12247270B2Anisotropic conductive film and method for producing the anisotropic conductive film including a base material having recesses and solder particles formed inside the recessesSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Mar 11, 2025·0 cites·12 claims
- 0750US2021229222A1Solder particles and method for producing solder particlesSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
- 0840US8845915B2Abrading agent and abrading methodONO HIROSHI·Filed 2010·Granted Sep 30, 2014·0 cites·13 claims
- 0939US8877644B2Polishing solution for copper polishing, and polishing method using sameONO HIROSHI·Filed 2011·Granted Nov 4, 2014·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →