Inventor · disambiguated record
Hyo-Soon Kang
Also filed as: KANG HYO-SOON
8 granted patents·2 pending applications·21 citations·filing 2012–2016
80Inventor score
Top patents by PatentIndex Score
10 records- 0188US9466593B2Stack semiconductor packageLEE DAE-HO·Filed 2015·Granted Oct 11, 2016·10 cites·20 claims
- 0278US9105503B2Package-on-package deviceKIM YONGHOON·Filed 2013·Granted Aug 11, 2015·5 cites·19 claims
- 0375US8791559B2Semiconductor package with package on package structureKIM YONG-HOON·Filed 2012·Granted Jul 29, 2014·4 cites·19 claims
- 0465US9355976B2Semiconductor memory chips and stack-type semiconductor packages including the sameKIM YONGHOON·Filed 2013·Granted May 31, 2016·2 cites·14 claims
- 0548US9390772B2Semiconductor device including option pads for determining an operating structure thereof, and a system having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jul 12, 2016·0 cites·6 claims
- 0646US10403331B2Semiconductor device having a floating option pad, and a method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 3, 2019·0 cites·11 claims
- 0743US9472539B2Semiconductor chip and a semiconductor package having a package on package (POP) structure including the semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 18, 2016·0 cites·24 claims
- 0842US2014319701A1Semiconductor chip and a semiconductor package having a package on package (pop) structure including the semiconductor chipKIM YONG-HOON·Filed 2013·Application pending·0 cites
- 0940US9355947B2Printed circuit board having traces and ball grid array package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 31, 2016·0 cites·20 claims
- 1031US2016013158A1Semiconductor packageKANG HYO-SOON·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →