Inventor · disambiguated record
James Edward Tersigni
Also filed as: TERSIGNI JAMES · TERSIGNI JAMES E · TERSIGNI JAMES EDWARD
13 granted patents·1 pending application·76 citations·filing 1997–2022
89Inventor score
Top patents by PatentIndex Score
14 records- 0194US11958235B23D printing using rotational components and improved light sourcesOrange Maker LLC·Filed 2021·Granted Apr 16, 2024·3 cites·43 claims
- 0287US9913389B2Tamper-respondent assembly with vent structureIBM·Filed 2015·Granted Mar 6, 2018·5 cites·18 claims
- 0384US6892781B2Method and apparatus for application of pressure to a workpiece by thermal expansionIBM·Filed 2002·Granted May 17, 2005·38 cites·12 claims
- 0472US10251288B2Tamper-respondent assembly with vent structureIBM·Filed 2017·Granted Apr 2, 2019·1 cites·20 claims
- 0565US11141908B23D printing using rotational components and improved light sourcesOrange Maker LLC·Filed 2018·Granted Oct 12, 2021·0 cites·56 claims
- 0659US8902605B2Adapter for plated through hole mounting of surface mount componentBUSCHEL DANIEL J·Filed 2012·Granted Dec 2, 2014·1 cites·21 claims
- 0752US2023175541A1Controlled friction for sliding assembliesOMC2 LLC·Filed 2022·Application pending·0 cites
- 0848US9296056B2Device for thermal management of surface mount devices during reflow solderingIBM·Filed 2014·Granted Mar 29, 2016·0 cites·18 claims
- 0947US8845206B2Apparatus for plugging multiple connectors with spring loaded sleeves into an adapter simultaneouslyCHAN KENNETH Y·Filed 2011·Granted Sep 30, 2014·1 cites·25 claims
- 1047US5871313APrecise self-aligning chamfer method and apparatusIBM·Filed 1997·Granted Feb 16, 1999·13 cites·25 claims
- 1142US7690108B2Self-compensating connector support method and apparatusIBM·Filed 2008·Granted Apr 6, 2010·0 cites·1 claims
- 1239US6053393AShaving blade for chip site dressingIBM·Filed 1999·Granted Apr 25, 2000·8 cites·12 claims
- 1334US6131794AShaving blade for chip site dressingIBM·Filed 1997·Granted Oct 17, 2000·6 cites·10 claims
- 1433US8939791B2Primary circuit board non-conductive void having different planar dimensions through board thickness to secure non-conducting locking member of holderIBM·Filed 2013·Granted Jan 27, 2015·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →