Inventor · disambiguated record
Shozo Minamitani
Also filed as: MINAMITANI SHOZO
24 granted patents·2 pending applications·367 citations·filing 1998–2009
96Inventor score
Top patents by PatentIndex Score
26 records- 0188US7827677B2Component mounting apparatusPANASONIC CORP·Filed 2005·Granted Nov 9, 2010·15 cites·2 claims
- 0285US7637714B2Apparatus and method for removing semiconductor chipPANASONIC CORP·Filed 2004·Granted Dec 29, 2009·34 cites·7 claims
- 0385US6706130B1Method and device for frictional connection and holding tool used for the frictional connection deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Mar 16, 2004·31 cites·24 claims
- 0484US6544377B1Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic componentsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Apr 8, 2003·40 cites·13 claims
- 0582US7020953B2Apparatus and method for mounting componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Apr 4, 2006·30 cites·10 claims
- 0679US7296727B2Apparatus and method for mounting electronic componentsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Nov 20, 2007·27 cites·26 claims
- 0779US6467670B2Method and apparatus for mounting componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Oct 22, 2002·19 cites·18 claims
- 0877US6193136B1Component mounting method and apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Feb 27, 2001·32 cites·23 claims
- 0976US8001678B2Component mounting apparatusPANASONIC CORP·Filed 2008·Granted Aug 23, 2011·4 cites·8 claims
- 1075US7219419B2Component mounting apparatus including a polishing deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted May 22, 2007·15 cites·22 claims
- 1174US7549567B2Component mounting tool, and method and apparatus for mounting component using this toolPANASONIC CORP·Filed 2007·Granted Jun 23, 2009·6 cites·17 claims
- 1273US7490652B2Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic componentsPANASONIC CORP·Filed 2005·Granted Feb 17, 2009·5 cites·6 claims
- 1373US7281322B2Component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted Oct 16, 2007·6 cites·3 claims
- 1472US7437818B2Component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Oct 21, 2008·12 cites·4 claims
- 1571US7938929B2Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic componentsPANASONIC CORP·Filed 2009·Granted May 10, 2011·4 cites·8 claims
- 1670US6506222B2Method and apparatus for mounting componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jan 14, 2003·11 cites·13 claims
- 1768US7290331B2Component mounting apparatus and component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted Nov 6, 2007·4 cites·2 claims
- 1859US6246789B1Component mounting apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Jun 12, 2001·31 cites·28 claims
- 1958US6439447B1Bump joining judging device and method, and semiconductor component production device and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Aug 27, 2002·23 cites·40 claims
- 2050US6572005B2Bump-joining methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jun 3, 2003·3 cites·6 claims
- 2149US7861908B2Component mounting method, component mounting apparatus, and ultrasonic bonding headPANASONIC CORP·Filed 2007·Granted Jan 4, 2011·0 cites·14 claims
- 2242US6321973B1Bump joining methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Nov 27, 2001·8 cites·2 claims
- 2341US6264704B1Method and apparatus for mounting componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Jul 24, 2001·7 cites·14 claims
- 2440US7229854B2Electronic component mounting method and apparatus and ultrasonic bonding headMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 12, 2007·0 cites·7 claims
- 2540US2003205607A1Bump joining methodFiled 2003·Application pending·0 cites
- 2640US2003121616A1Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic componentsFiled 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →