Inventor · disambiguated record
Junshi Yoshioka
Also filed as: YOSHIOKA JUNSHI
9 granted patents·2 pending applications·166 citations·filing 1997–2007
88Inventor score
Top patents by PatentIndex Score
11 records- 0189US6270889B1Making and using an ultra-thin copper foilMITSUI MINING & SMELTING CO·Filed 1998·Granted Aug 7, 2001·64 cites·43 claims
- 0285US6183880B1Composite foil of aluminum and copperMITSUI MINING & SMELTING CO·Filed 1998·Granted Feb 6, 2001·46 cites·26 claims
- 0383US8715836B2Surface-treated electro-deposited copper foil and method for manufacturing the sameDOBASHI MAKOTO·Filed 2007·Granted May 6, 2014·7 cites·22 claims
- 0480US6541126B1Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foilMITSUI MINING & SMELTING CO·Filed 2000·Granted Apr 1, 2003·30 cites·5 claims
- 0571US6610418B1Electolytic copper foil with carrier foil and method for manufacturing the sameMITSUI MINING & SMELTING CO·Filed 2000·Granted Aug 26, 2003·7 cites·7 claims
- 0668US8419920B2Method of preparing electrolytic copper solution acidified with sulfuric acid, sulfuric-acid-acidified electrolytic copper solution prepared by the preparation method, and electrodeposited copper filmTOMONAGA SAKIKO·Filed 2007·Granted Apr 16, 2013·1 cites·11 claims
- 0757US7217464B2Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing methodMITSUI MINING & SMELTING CO·Filed 2003·Granted May 15, 2007·2 cites·15 claims
- 0851US2009166213A1Production method of electro-deposited copper foil, electro-deposited copper foil obtained by the production method, surface-treated copper foil obtained by using the electro-deposited copper foil and copper-clad laminate obtained by using the electro-deposited copper foil or the surface-treated copper foilMITSUI MINING & SMELTING CO·Filed 2006·Application pending·0 cites
- 0946US6984453B2Electrolyte copper foil having carrier foil, manufacturing method thereof, and layered plate using the electrolyte copper foil having carrier foilMITSUI MINING & SMELTING CO·Filed 2002·Granted Jan 10, 2006·7 cites·22 claims
- 1037US2004188263A1Copper foil with carrier foil, process for producing the same and copper clad laminate including the copper foil with carrier foilFiled 2003·Application pending·0 cites
- 1131US6071629AOrganic rust-proof treated copper foilMITSUI MINING & SMELTING CO·Filed 1997·Granted Jun 6, 2000·2 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →