Inventor · disambiguated record
Lelan D. Warren
Also filed as: WARREN LELAN · WARREN LELAN D
13 granted patents·337 citations·filing 1996–2020
93Inventor score
Files withMICRON TECHNOLOGY INC8DICKERSON HOMER L1HARRES LUIZ C1SIEMENS ENERGY & AUTOMAT1SIEMENS INDUSTRY INC1
Top patents by PatentIndex Score
13 records- 0195US5894218AMethod and apparatus for automatically positioning electronic dice within component packagesMICRON TECHNOLOGY INC·Filed 1996·Granted Apr 13, 1999·137 cites·42 claims
- 0289US6900459B2Apparatus for automatically positioning electronic dice within component packagesMICRON TECHNOLOGY INC·Filed 2002·Granted May 31, 2005·28 cites·42 claims
- 0386US6064194AMethod and apparatus for automatically positioning electronic dice within component packagesMICRON TECHNOLOGY INC·Filed 1996·Granted May 16, 2000·51 cites·14 claims
- 0485US6492187B1Method for automatically positioning electronic die within component packagesMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 10, 2002·21 cites·6 claims
- 0582US5955877AMethod and apparatus for automatically positioning electronic dice within component packagesMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 21, 1999·40 cites·7 claims
- 0676US11479420B2Automatic tote accumulator with cam-actuated stack retaining latchSIEMENS LOGISTICS LLC·Filed 2020·Granted Oct 25, 2022·1 cites·20 claims
- 0775US7232025B1Electromagnetic conveyor stopSIEMENS ENERGY & AUTOMAT·Filed 2006·Granted Jun 19, 2007·10 cites·15 claims
- 0865US6210984B1Method and apparatus for automatically positioning electronic dice within component packagesMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 3, 2001·17 cites·11 claims
- 0964US6150828AMethod and apparatus for automatically positioning electronic dice with component packagesMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 21, 2000·16 cites·22 claims
- 1062US8796577B2Multi-machine mail sorting systemHARRES LUIZ C·Filed 2008·Granted Aug 5, 2014·4 cites·11 claims
- 1158US8002263B2Pickoff mechanism for mail feederSIEMENS INDUSTRY INC·Filed 2008·Granted Aug 23, 2011·3 cites·10 claims
- 1252US6353312B1Method for positioning a semiconductor die within a temporary packageMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 5, 2002·9 cites·9 claims
- 1335US9637263B2Film-wrapped bundle openerDICKERSON HOMER L·Filed 2011·Granted May 2, 2017·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →