Inventor · disambiguated record
Christopher P. Wyland
Also filed as: WYLAND CHRISTOPHER · WYLAND CHRISTOPHER P · WYLAND CHRISTOPHER PAUL
28 granted patents·1 pending application·924 citations·filing 1992–2023
97Inventor score
Files withINTEGRATED DEVICE TECH13JUNIPER NETWORKS INC4TAIWAN SEMICONDUCTOR MFG CO LTD3WYLAND CHRISTOPHER3WYLAND CHRISTOPHER P2
Top patents by PatentIndex Score
29 records- 0197US5986885ASemiconductor package with internal heatsink and assembly methodINTEGRATED DEVICE TECH·Filed 1997·Granted Nov 16, 1999·274 cites·21 claims
- 0295US8680677B2Carbon nanotube-based conductive connections for integrated circuit devicesWYLAND CHRISTOPHER·Filed 2005·Granted Mar 25, 2014·45 cites·22 claims
- 0394US9337138B1Capacitors within an interposer coupled to supply and ground planes of a substrateABUGHARBIEH KHALDOON S·Filed 2012·Granted May 10, 2016·36 cites·16 claims
- 0493US11051431B2Thermal management with variable conductance heat pipeJUNIPER NETWORKS INC·Filed 2018·Granted Jun 29, 2021·7 cites·20 claims
- 0592US11653477B2Thermal management with variable conductance heat pipeJUNIPER NETWORKS INC·Filed 2021·Granted May 16, 2023·2 cites·20 claims
- 0692USRE36907ELeadframe with power and ground planesINTEGRATED DEVICE TECH·Filed 1997·Granted Oct 10, 2000·121 cites·47 claims
- 0792US5457340ALeadframe with power and ground planesINTEGRATED DEVICE TECH·Filed 1992·Granted Oct 10, 1995·118 cites·47 claims
- 0891US10292307B1Thermal heatsinkJUNIPER NETWORKS INC·Filed 2018·Granted May 14, 2019·7 cites·20 claims
- 0988US8143976B2High impedance electrical connection viaWYLAND CHRISTOPHER P·Filed 2009·Granted Mar 27, 2012·20 cites·20 claims
- 1086US6039471ADevice for simulating dissipation of thermal power by a board supporting an electronic componentINTEGRATED DEVICE TECH·Filed 1996·Granted Mar 21, 2000·59 cites·28 claims
- 1181US8410579B2Power distribution networkGHIA ATUL V·Filed 2010·Granted Apr 2, 2013·8 cites·20 claims
- 1278US12027465B2Impedance controlled electrical interconnection employing meta-materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 1378US5679975AConductive encapsulating shield for an integrated circuitINTEGRATED DEVICE TECH·Filed 1995·Granted Oct 21, 1997·56 cites·13 claims
- 1477US9377802B1Dynamic configuration of equivalent series resistanceWYLAND CHRISTOPHER P·Filed 2012·Granted Jun 28, 2016·5 cites·19 claims
- 1571US5997174AMethod for determining a thermal parameter of a device by measuring thermal resistance of a substrate carrying the deviceINTEGRATED DEVICE TECH·Filed 1997·Granted Dec 7, 1999·31 cites·17 claims
- 1670US9006098B2Impedance controlled electrical interconnection employing meta-materialsWYLAND CHRISTOPHER·Filed 2008·Granted Apr 14, 2015·3 cites·24 claims
- 1768US10483209B2Impedance controlled electrical interconnection employing meta-materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 19, 2019·1 cites·20 claims
- 1865US8451072B2Method for transmission lines using meta-materialsWYLAND CHRISTOPHER·Filed 2008·Granted May 28, 2013·3 cites·18 claims
- 1964US11937368B2Structure for circuit interconnectsOPENLIGHT PHOTONICS INC·Filed 2021·Granted Mar 19, 2024·0 cites·15 claims
- 2064US11456255B2Impedance controlled electrical interconnection employing meta-materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 27, 2022·0 cites·20 claims
- 2163US5870517APackage including self-aligned laser diode and method of aligning a laser diodeINTEGRATED DEVICE TECH·Filed 1997·Granted Feb 9, 1999·26 cites·16 claims
- 2262US6084770ADevice and method for convective cooling of an electronic componentINTEGRATED DEVICE TECH·Filed 1997·Granted Jul 4, 2000·23 cites·21 claims
- 2360US5931580AApparatus for measuring junction temperatureINTEGRATED DEVICE TECH·Filed 1997·Granted Aug 3, 1999·21 cites·20 claims
- 2455US6111199AIntegrated circuit package using a gas to insulate electrical conductorsINTEGRATED DEVICE TECH·Filed 1998·Granted Aug 29, 2000·26 cites·22 claims
- 2553US10999923B2Structure for circuit interconnectsJUNIPER NETWORKS INC·Filed 2018·Granted May 4, 2021·0 cites·17 claims
- 2651US2025168971A1Trace width modulationAMPERE COMPUTING LLC·Filed 2023·Application pending·0 cites
- 2746US5897335AFlip-chip bonding methodINTEGRATED DEVICE TECH·Filed 1997·Granted Apr 27, 1999·14 cites·3 claims
- 2844US5784255ADevice and method for convective cooling of an electronic componentINTEGRATED DEVICE TECH·Filed 1995·Granted Jul 21, 1998·10 cites·18 claims
- 2937US5962924ASemi-conductor die interconnectINTEGRATED DEVICE TECH·Filed 1998·Granted Oct 5, 1999·8 cites·17 claims
Join the waitlist — get patent alerts
Get an alert when Christopher P. Wyland files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →