Inventor · disambiguated record
Hai Fu
Also filed as: FU HAI · FU HAI-LONG
12 granted patents·16 pending applications·37 citations·filing 2006–2025
88Inventor score
Files withOWENS CORNING INTELLECTUAL CAPITAL LLC10YANGTZE MEMORY TECH CO LTD5VISHAY GEN SEMICONDUCTOR LLC4CHINA MOBILE COMMUNICATION CORP2CHOU TA-TE2
Top patents by PatentIndex Score
28 records- 0195US12065835B2Roofing materials including a layer of a parting agentOWENS CORNING INTELLECTUAL CAPITAL LLC·Filed 2020·Granted Aug 20, 2024·3 cites·16 claims
- 0281US2024368890A1Roofing materials including a layer of a parting agentOWENS CORNING INTELLECTUAL CAPITAL LLC·Filed 2024·Application pending·0 cites
- 0381US2025370926A1Methods of operating memory system and memory systemsYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 0476US8048714B2Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilitiesVISHAY GEN SEMICONDUCTOR LLC·Filed 2007·Granted Nov 1, 2011·8 cites·11 claims
- 0575US12436879B2Methods of updating allocation state of logical block in logical block management tableYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Oct 7, 2025·0 cites·20 claims
- 0675US9531143B2RJ45 socket connector having a conductive terminal for preventing yield due to mistaken insertionFOXCONN INTERCONNECT TECHNOLOGY LTD·Filed 2015·Granted Dec 27, 2016·4 cites·20 claims
- 0766US2024059856A1Multi-material sheathing system with sustained thermal insulation performanceOWENS CORNING INTELLECTUAL CAPITAL LLC·Filed 2023·Application pending·0 cites
- 0862US2024060303A1Multi-material sheathing systemOWENS CORNING INTELLECTUAL CAPITAL LLC·Filed 2023·Application pending·0 cites
- 0960US7719096B2Semiconductor device and method for manufacturing a semiconductor deviceVISHAY GEN SEMICONDUCTOR LLC·Filed 2007·Granted May 18, 2010·2 cites·18 claims
- 1059US8269338B2Semiconductor device having improved heat dissipation capabilitiesCHOU TA-TE·Filed 2007·Granted Sep 18, 2012·2 cites·14 claims
- 1156US12468485B2Memory systems and operating methods thereof, electronic systemsYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·20 claims
- 1256US2025123961A1Memory system, operation method thereof, electronic apparatus, and computer readable storage mediumYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1354USD573116SBridge rectifier package with heat sinkVISHAY GEN SEMICONDUCTOR LLC·Filed 2006·Granted Jul 15, 2008·7 cites·1 claims
- 1452US2024059052A1Multi-material sheathing system with improved thermal insulationOWENS CORNING INTELLECTUAL CAPITAL LLC·Filed 2023·Application pending·0 cites
- 1552US2025262839A1Multi-material sheathing system with improved thermal insulation performanceOWENS CORNING INTELLECTUAL CAPITAL LLC·Filed 2025·Application pending·0 cites
- 1651US10487549B2HingeFU HAI·Filed 2017·Granted Nov 26, 2019·2 cites·13 claims
- 1751US2025263532A1Multi-material sheathing system with sustained thermal insulation performanceOWENS CORNING INTELLECTUAL CAPITAL LLC·Filed 2025·Application pending·0 cites
- 1851US2025262848A1Multi-material sheathing systemOWENS CORNING INTELLECTUAL CAPITAL LLC·Filed 2025·Application pending·0 cites
- 1951US2019163846A1Method and apparatus of using drive test data for propagation model calibrationCHINA MOBILE COMMUNICATION CORP·Filed 2018·Application pending·0 cites
- 2050US2024199914A1Modified filler particles for asphalt shinglesOWENS CORNING INTELLECTUAL CAPITAL LLC·Filed 2023·Application pending·0 cites
- 2148USD616387SBridge rectifier packageVISHAY GEN SEMICONDUCTOR LLC·Filed 2008·Granted May 25, 2010·5 cites·1 claims
- 2247US2013185036A1Method and apparatus of using drive test data for propagation model calibrationCHINA MOBILE COMM CORP·Filed 2013·Application pending·0 cites
- 2347US2017228476A1Method and apparatus of using drive test data for propagation model calibrationCHINA MOBILE COMMUNICATION CORP·Filed 2016·Application pending·0 cites
- 2447US2025165146A1Memory systems and operating methods thereof and memory controllersYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 2546US2022389715A1Coated roofing materialsOWENS CORNING INTELLECTUAL CAPITAL LLC·Filed 2022·Application pending·0 cites
- 2644USD654881SBridge rectifier package with heat sinkCHOU TA-TE·Filed 2010·Granted Feb 28, 2012·4 cites·1 claims
- 2744US2009157342A1Method and apparatus of using drive test data for propagation model calibrationCHINA MOBILE COMM CORP DESIGN·Filed 2008·Application pending·0 cites
- 2834US9484691B2RJ45 socket connector having a terminal module prventing dislodgment of a terminal due to mistaken insertionFOXCONN INTERCONNECT TECHNOLOGY LTD·Filed 2015·Granted Nov 1, 2016·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →