Inventor · disambiguated record
Jae Yeop Lee
Also filed as: LEE JAE YEOP
6 granted patents·4 pending applications·1 citations·filing 2013–2025
65Inventor score
Top patents by PatentIndex Score
10 records- 0163US12464857B2Transfer resin for transferring an LED chip, and an apparatus for transferring an LED chip by using the sameAGASEMICON CORP·Filed 2022·Granted Nov 4, 2025·0 cites·17 claims
- 0259US2025366257A1Transfer resin for transferring an led chip, and an apparatus for transferring an led chip by using the sameAGASEMICON CORP·Filed 2025·Application pending·0 cites
- 0358US9929309B2Light-emitting diode package and method of manufacturing the sameLIGHTIZER KOREA CO·Filed 2015·Granted Mar 27, 2018·1 cites·13 claims
- 0451US9023671B2Method of disposing phosphor layersLIGHTIZER KOREA CO·Filed 2014·Granted May 5, 2015·0 cites·14 claims
- 0542US9942963B2Apparatus for manufacturing fluorescent layersLIGHTIZER KOREA CO·Filed 2013·Granted Apr 10, 2018·0 cites·5 claims
- 0641US2019393385A1Manufacturing method of color conversion diodeLIGHTIZER KOREA CO LTD·Filed 2019·Application pending·0 cites
- 0740US2022199882A1Light emitting diode chip-scale package and method for manufacturing sameLIGHTIZER CO LTD·Filed 2020·Application pending·0 cites
- 0839US2022254673A1A photosensitive transfer resin for transferring an led chip, a method of transferring an led chip using the photosensitive transfer resin, and a method of manufacturing a display device using the sameLIGHTIZER CO LTD·Filed 2021·Application pending·0 cites
- 0936US9590156B2Light-emitting device package and method of manufacturing thereofLIGHTIZER KOREA CO·Filed 2015·Granted Mar 7, 2017·0 cites·12 claims
- 1030US10950762B2Round chip scale package and manufacturing method thereforLIGHTIZER CO LTD·Filed 2017·Granted Mar 16, 2021·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →