Inventor · disambiguated record
Sashi S. Kandanur
Also filed as: KANDANUR SASHI · KANDANUR SASHI S · KANDANUR SASHI SHEKHAR
10 granted patents·22 pending applications·7 citations·filing 2015–2024
80Inventor score
Top patents by PatentIndex Score
32 records- 0189US11935857B2Surface finishes with low RBTV for fine and mixed bump pitch architecturesINTEL CORP·Filed 2022·Granted Mar 19, 2024·1 cites·22 claims
- 0281US11488918B2Surface finishes with low rBTV for fine and mixed bump pitch architecturesINTEL CORP·Filed 2018·Granted Nov 1, 2022·3 cites·15 claims
- 0373US11127682B2Semiconductor package having nonspherical filler particlesINTEL CORP·Filed 2017·Granted Sep 21, 2021·2 cites·15 claims
- 0462US2025054823A1Methods and apparatus to mitigate cracking in glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0560US10798817B2Method for making a flexible wearable circuitINTEL CORP·Filed 2015·Granted Oct 6, 2020·1 cites·19 claims
- 0660US2025279342A1Metal seed layers with different sheet resistances in integrated circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 0759US12349282B2Capacitors in through glass viasINTEL CORP·Filed 2021·Granted Jul 1, 2025·0 cites·23 claims
- 0858US2025125201A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0958US2025126814A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 1058US2025125202A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 1158US2025120102A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 1256US2025107112A1Inductors for semiconductor package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 1355US2024222248A1Architectures and methods for metal lamination on a glass layerINTEL CORP·Filed 2022·Application pending·0 cites
- 1455US2025112179A1Technologies for a coaxial inductor in a glass coreINTEL CORP·Filed 2023·Application pending·0 cites
- 1555US2021260718A1Chemical mechanical polishing using fluorescence-based endpoint detectionINTEL CORP·Filed 2020·Application pending·0 cites
- 1655US2025183179A1Passive structures in embedded bridge architecturesINTEL CORP·Filed 2023·Application pending·0 cites
- 1754US2024162158A1Package architecture with microfluidic channels in glass substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 1854US2024321657A1Photonic integrated circuit packages and methods of manufacturing the sameINTEL CORP·Filed 2023·Application pending·0 cites
- 1953US12334422B2Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substratesINTEL CORP·Filed 2021·Granted Jun 17, 2025·0 cites·24 claims
- 2053US2024071883A1Self-alignment of glass core halves using protruded bumpsINTEL CORP·Filed 2022·Application pending·0 cites
- 2153US2025106982A1Nanotwin liner for through glass viasINTEL CORP·Filed 2023·Application pending·0 cites
- 2252US2024395661A1In-situ micro-fluidic channels for heat dissipation in glass substrateINTEL CORP·Filed 2023·Application pending·0 cites
- 2352US2024332100A1Glass-integrated inductors in integrated circuit packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 2451US12476175B2Glass substrates having transverse capacitors for use with semiconductor packages and related methodsINTEL CORP·Filed 2021·Granted Nov 18, 2025·0 cites·17 claims
- 2551US2024312853A1Via structures in bonded glass substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 2651US2024312888A1Via structures in bonded glass substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 2750US2024327201A1Mems dies embedded in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 2846US10428439B2Predictive capability for electroplating shield designINTEL CORP·Filed 2015·Granted Oct 1, 2019·0 cites·12 claims
- 2946US10327330B2Stretchable electronic assemblyINTEL CORP·Filed 2015·Granted Jun 18, 2019·0 cites·18 claims
- 3045US10856424B2Electronic assembly that includes void free holesINTEL CORP·Filed 2015·Granted Dec 1, 2020·0 cites·8 claims
- 3145US2023107096A1Through glass via with a metal wallINTEL CORP·Filed 2021·Application pending·0 cites
- 3244US2023082385A1Defect-free through glass via metallization implementing a reverse filling architectureECTON JEREMY D·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →