Inventor · disambiguated record
Yoshiki Sota
Also filed as: SOTA YOSHIKI
27 granted patents·6 pending applications·1,729 citations·filing 1995–2016
97Inventor score
Top patents by PatentIndex Score
33 records- 0197US6100594ASemiconductor device and method of manufacturing the sameSHARP KK·Filed 1998·Granted Aug 8, 2000·290 cites·29 claims
- 0296US6979905B2Semiconductor deviceSHARP KK·Filed 2004·Granted Dec 27, 2005·79 cites·22 claims
- 0396US5874784ASemiconductor device having external connection terminals provided on an interconnection plate and fabrication process thereforSHARP KK·Filed 1996·Granted Feb 23, 1999·289 cites·19 claims
- 0495US7876572B2Wiring board and semiconductor apparatusSHARP KK·Filed 2007·Granted Jan 25, 2011·41 cites·8 claims
- 0595US6181002B1Semiconductor device having a plurality of semiconductor chipsSHARP KK·Filed 1999·Granted Jan 30, 2001·288 cites·15 claims
- 0694US6229217B1Semiconductor device and method of manufacturing the sameSHARP KK·Filed 2000·Granted May 8, 2001·89 cites·33 claims
- 0792US6352879B1Semiconductor device and method of manufacturing the sameSHARP KK·Filed 2000·Granted Mar 5, 2002·62 cites·15 claims
- 0888US6285086B1Semiconductor device and substrate for semiconductor deviceSHARP KK·Filed 2000·Granted Sep 4, 2001·55 cites·16 claims
- 0985US8749263B2Semiconductor apparatus, inspection method thereof and electric deviceOHTA MASAYUKI·Filed 2011·Granted Jun 10, 2014·11 cites·14 claims
- 1085US6198165B1Semiconductor deviceSHARP KK·Filed 1999·Granted Mar 6, 2001·92 cites·10 claims
- 1185US6064111ASubstrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor packageHITACHI COMPANY LTD·Filed 1997·Granted May 16, 2000·84 cites·11 claims
- 1280US6403895B1Wiring substance and semiconductorSHARP KK·Filed 2000·Granted Jun 11, 2002·29 cites·11 claims
- 1378US6236108B1Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor packageHITACHI CHEMICAL CO LTD·Filed 2000·Granted May 22, 2001·24 cites·14 claims
- 1477US6545367B2Semiconductor package substrate, semiconductor packageSHARP KK·Filed 2002·Granted Apr 8, 2003·21 cites·9 claims
- 1576US5646829AResin sealing type semiconductor device having fixed inner leadsSHARP KK·Filed 1995·Granted Jul 8, 1997·50 cites·19 claims
- 1675US6265783B1Resin overmolded type semiconductor deviceSHARP KK·Filed 1999·Granted Jul 24, 2001·48 cites·9 claims
- 1775US6250606B1Substrate for semiconductor device, semiconductor device and manufacturing method thereofSHARP KK·Filed 2000·Granted Jun 26, 2001·20 cites·33 claims
- 1875US5672912AResin-sealed type semiconductor device and method for manufacturing the sameSHARP KK·Filed 1996·Granted Sep 30, 1997·50 cites·11 claims
- 1974US6201707B1Wiring substrate used for a resin-sealing type semiconductor device and a resin-sealing type semiconductor device structure using such a wiring substrateSHARP KK·Filed 1999·Granted Mar 13, 2001·44 cites·11 claims
- 2074US5757080AResin-sealed semiconductor deviceSHARP KK·Filed 1996·Granted May 26, 1998·48 cites·30 claims
- 2173USRE41826ESemiconductor deviceSHARP KK·Filed 2007·Granted Oct 19, 2010·5 cites·30 claims
- 2258USRE38806ESemiconductor device and method of manufacturing the sameSHARP KK·Filed 2003·Granted Oct 4, 2005·6 cites·33 claims
- 2352US6731014B2Semiconductor package substrate, semiconductor packageSHARP KK·Filed 2003·Granted May 4, 2004·4 cites·14 claims
- 2450US9537072B2Light emitting device, lead frame and resin cavity molding packageSHARP KK·Filed 2016·Granted Jan 3, 2017·0 cites·9 claims
- 2547US9331254B2Light emitting deviceSOTA YOSHIKI·Filed 2012·Granted May 3, 2016·0 cites·9 claims
- 2643US2007035036A1Semiconductor device, laminated semiconductor device, and wiring substrateSHARP KK·Filed 2006·Application pending·0 cites
- 2741US2009184413A1Insulative wiring board, semiconductor package using the same, and method for producing the insulative wiring boardTATSUMI KAZUAKI·Filed 2008·Application pending·0 cites
- 2840US8436456B2Wiring board, semiconductor device and method for manufacturing semiconductor deviceSOTA YOSHIKI·Filed 2009·Granted May 7, 2013·0 cites·10 claims
- 2936US9537065B2Light-emitting device with reflective resinSOTA YOSHIKI·Filed 2012·Granted Jan 3, 2017·0 cites·20 claims
- 3036US2009102049A1Semiconductor device, layered type semiconductor device using the same, base substrate and semiconductor device manufacturing methodMURATA KATSUMASA·Filed 2007·Application pending·0 cites
- 3135US2001007373A1Tape carrier for semiconductor device and method of producing sameFiled 2001·Application pending·0 cites
- 3233US2018325427A1Imaging device, biometric authentication device, and semiconductor laserSHARP KK·Filed 2016·Application pending·0 cites
- 3332US2016353544A1Light-emitting deviceSHARP KK·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →