Inventor · disambiguated record
William A. Wojtczak
Also filed as: FINE LEGAL REPRESENTATIVE STEPHEN A · WOJTCZAK WILLIAM · WOJTCZAK WILLIAM A
48 granted patents·14 pending applications·1,014 citations·filing 1997–2024
98Inventor score
Files withFUJIFILM ELECTRONIC MAT USA INC26ADVANCED TECH MATERIALS24SACHEM INC2WOJTCZAK WILLIAM A2ADVANCED TECHNOLOGIES MATERIAL1
Top patents by PatentIndex Score
62 records- 0196US10415005B2Cleaning formulation for removing residues on surfacesFUJIFILM ELECTRONIC MAT USA INC·Filed 2019·Granted Sep 17, 2019·7 cites·15 claims
- 0296US9562211B2Cleaning formulation for removing residues on surfacesFUJIFILM ELECTRONIC MAT USA INC·Filed 2014·Granted Feb 7, 2017·15 cites·48 claims
- 0396US6773873B2pH buffered compositions useful for cleaning residue from semiconductor substratesADVANCED TECH MATERIALS·Filed 2002·Granted Aug 10, 2004·115 cites·14 claims
- 0495US6896826B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateADVANCED TECH MATERIALS·Filed 2001·Granted May 24, 2005·74 cites·49 claims
- 0594US10253282B2Cleaning formulation for removing residues on surfacesFUJIFILM ELECTRONIC MAT USA INC·Filed 2016·Granted Apr 9, 2019·6 cites·43 claims
- 0694US6409781B1Polishing slurries for copper and associated materialsADVANCED TECH MATERIALS·Filed 2000·Granted Jun 25, 2002·71 cites·42 claims
- 0792US6692546B2Chemical mechanical polishing compositions for metal and associated materials and method of using sameADVANCED TECH MATERIALS·Filed 2001·Granted Feb 17, 2004·70 cites·39 claims
- 0891US11508569B2Surface treatment compositions and methodsFUJIFILM ELECTRONIC MAT USA INC·Filed 2020·Granted Nov 22, 2022·2 cites·24 claims
- 0991US6344432B1Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structuresADVANCED TECH MATERIALS·Filed 2000·Granted Feb 5, 2002·51 cites·14 claims
- 1090US11499099B2Etching compositionFUJIFILM ELECTRONIC MAT USA INC·Filed 2020·Granted Nov 15, 2022·2 cites·27 claims
- 1190US9914902B2Stripping compositions for removing photoresists from semiconductor substratesFUJIFILM ELECTRONIC MAT USA INC·Filed 2015·Granted Mar 13, 2018·6 cites·27 claims
- 1290US6755989B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateADVANCED TECH MATERIALS·Filed 2001·Granted Jun 29, 2004·43 cites·12 claims
- 1389US10927329B2Cleaning formulation for removing residues on surfacesFUJIFILM ELECTRONIC MAT USA INC·Filed 2019·Granted Feb 23, 2021·2 cites·15 claims
- 1489US10696933B2Cleaning formulation for removing residues on surfacesFUJIFILM ELECTRONIC MAT USA INC·Filed 2019·Granted Jun 30, 2020·2 cites·40 claims
- 1589US7605113B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateADVANCED TECH MATERIALS·Filed 2005·Granted Oct 20, 2009·11 cites·22 claims
- 1689US7029373B2Chemical mechanical polishing compositions for metal and associated materials and method of using sameADVANCED TECH MATERIALS·Filed 2001·Granted Apr 18, 2006·47 cites·40 claims
- 1788US10266799B2Stripping compositions for removing photoresists from semiconductor substratesFUJIFILM ELECTRONIC MAT USA INC·Filed 2017·Granted Apr 23, 2019·4 cites·31 claims
- 1888US7994062B2Selective silicon etch processSACHEM INC·Filed 2009·Granted Aug 9, 2011·18 cites·25 claims
- 1986US6566315B2Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structuresADVANCED TECH MATERIALS·Filed 2001·Granted May 20, 2003·50 cites·28 claims
- 2086US6224785B1Aqueous ammonium fluoride and amine containing compositions for cleaning inorganic residues on semiconductor substratesADVANCED TECH MATERIALS·Filed 1997·Granted May 1, 2001·84 cites·25 claims
- 2185US11639487B2Cleaning formulation for removing residues on surfacesFUJIFILM ELECTRONIC MAT USA INC·Filed 2022·Granted May 2, 2023·0 cites·29 claims
- 2285US11618867B2Cleaning formulation for removing residues on surfacesFUJIFILM ELECTRONIC MAT USA INC·Filed 2022·Granted Apr 4, 2023·0 cites·30 claims
- 2385US6527819B2Polishing slurries for copper and associated materialsADVANCED TECH MATERIALS·Filed 2001·Granted Mar 4, 2003·24 cites·40 claims
- 2485US6280651B1Selective silicon oxide etchant formulation including fluoride salt, chelating agent, and glycol solventADVANCED TECH MATERIALS·Filed 1998·Granted Aug 28, 2001·69 cites·13 claims
- 2582US6383410B1Selective silicon oxide etchant formulation including fluoride salt, chelating agent, and glycol solventADVANCED TECH MATERIALS·Filed 2001·Granted May 7, 2002·24 cites·13 claims
- 2682US2022275313A1Cleaning formulation for removing residues on surfacesFUJIFILM ELECTRONIC MAT USA INC·Filed 2022·Application pending·0 cites
- 2781US11401487B2Cleaning formulation for removing residues on surfacesFUJIFILM ELECTRONIC MAT USA INC·Filed 2022·Granted Aug 2, 2022·0 cites·28 claims
- 2881US11174394B2Surface treatment compositions and articles containing sameFUJIFILM ELECTRONIC MAT USA INC·Filed 2018·Granted Nov 16, 2021·2 cites·23 claims
- 2979US10593538B2Surface treatment methods and compositions thereforFUJIFILM ELECTRONIC MAT USA INC·Filed 2018·Granted Mar 17, 2020·2 cites·64 claims
- 3079US7534752B2Post plasma ashing wafer cleaning formulationADVANCED TECH MATERIALS·Filed 2001·Granted May 19, 2009·23 cites·34 claims
- 3178US6967169B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateADVANCED TECH MATERIALS·Filed 2004·Granted Nov 22, 2005·16 cites·13 claims
- 3276US11286444B2Cleaning formulation for removing residues on surfacesFUJIFILM ELECTRONIC MAT USA INC·Filed 2020·Granted Mar 29, 2022·0 cites·25 claims
- 3376US10947484B2Stripping compositions for removing photoresists from semiconductor substratesFUJIFILM ELECTRONIC MAT USA INC·Filed 2019·Granted Mar 16, 2021·1 cites·41 claims
- 3476US7662762B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substratesADVANCED TECH MATERIALS·Filed 2005·Granted Feb 16, 2010·4 cites·20 claims
- 3576US6306807B1Boric acid containing compositions for stripping residues from semiconductor substratesADVANCED TECH MATERIALS·Filed 1999·Granted Oct 23, 2001·38 cites·7 claims
- 3675US6875733B1Ammonium borate containing compositions for stripping residues from semiconductor substratesADVANCED TECH MATERIALS·Filed 1998·Granted Apr 5, 2005·31 cites·26 claims
- 3774US8647523B2Etching compositionTAKAHASHI TOMONORI·Filed 2012·Granted Feb 11, 2014·3 cites·30 claims
- 3874US7192910B2Cleaning solutions and etchants and methods for using sameSACHEM INC·Filed 2004·Granted Mar 20, 2007·22 cites·30 claims
- 3974US6211126B1Formulations including a 1, 3-dicarbonyl compound chelating agent for stripping residues from semiconductor substratesADVANCED TECH MATERIALS·Filed 1997·Granted Apr 3, 2001·47 cites·22 claims
- 4073US2024174924A1Etching compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2023·Application pending·0 cites
- 4172US2024258111A1Surface Treatment Compositions and MethodsFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Application pending·0 cites
- 4269US6936542B2Polishing slurries for copper and associated materialsADVANCED TECH MATERIALS·Filed 2001·Granted Aug 30, 2005·9 cites·45 claims
- 4368US11447642B2Methods of using surface treatment compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2021·Granted Sep 20, 2022·0 cites·19 claims
- 4468US2023048767A1Surface Treatment Compositions and MethodsFUJIFILM ELECTRONIC MAT USA INC·Filed 2022·Application pending·0 cites
- 4563US6660700B2Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structuresADVANCED TECHNOLOGIES MATERIAL·Filed 2001·Granted Dec 9, 2003·10 cites·14 claims
- 4661US6492310B2Boric acid containing compositions for stripping residues from semiconductor substratesADVANCED TECH MATERIALS·Filed 2001·Granted Dec 10, 2002·6 cites·18 claims
- 4761US2024279549A1Etching compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Application pending·0 cites
- 4860US2024254415A1Surface Treatment Compositions and MethodsFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Application pending·0 cites
- 4959US11208616B2Stripping compositions for removing photoresists from semiconductor substratesFUJIFILM ELECTRONIC MAT USA INC·Filed 2020·Granted Dec 28, 2021·0 cites·41 claims
- 5059US2020248075A1Etching compositionsFUJIFILM ELECTRONIC MAT USA INC·Filed 2020·Application pending·0 cites
Showing the top 50 of 62 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →