Inventor · disambiguated record
Katsuo Honda
Also filed as: HONDA KATSUO
13 granted patents·227 citations·filing 1988–2001
92Inventor score
Files withTOKYO SEIMITSU CO LTD13
Top patents by PatentIndex Score
13 records- 0187US5816895ASurface grinding method and apparatusTOKYO SEIMITSU CO LTD·Filed 1997·Granted Oct 6, 1998·78 cites·6 claims
- 0278US4852304AApparatus and method for slicing a waferTOKYO SEIMITSU CO LTD·Filed 1988·Granted Aug 1, 1989·24 cites·8 claims
- 0366US5791976ASurface machining method and apparatusTOKYO SEIMITSU CO LTD·Filed 1996·Granted Aug 11, 1998·22 cites·9 claims
- 0463US5295331AMethod of chamfering semiconductor waferTOKYO SEIMITSU CO LTD·Filed 1992·Granted Mar 22, 1994·41 cites·4 claims
- 0560US6752701B1Planarization apparatus with grinding and etching devices and holding device for moving workpiece between said devicesTOKYO SEIMITSU CO LTD·Filed 2000·Granted Jun 22, 2004·7 cites·3 claims
- 0657US6042459ASurface machining method and apparatusTOKYO SEIMITSU CO LTD·Filed 1998·Granted Mar 28, 2000·15 cites·9 claims
- 0752US6913526B2Polishing machine for polishing periphery of sheetTOKYO SEIMITSU CO LTD·Filed 2001·Granted Jul 5, 2005·5 cites·6 claims
- 0851US4903681AMethod and apparatus for cutting a cylindrical materialTOKYO SEIMITSU CO LTD·Filed 1988·Granted Feb 27, 1990·12 cites·13 claims
- 0947US4894956AApparatus and method for slicing a waferTOKYO SEIMITSU CO LTD·Filed 1989·Granted Jan 23, 1990·9 cites·2 claims
- 1038US6030278ASurface machining method and apparatusTOKYO SEIMITSU CO LTD·Filed 1998·Granted Feb 29, 2000·6 cites·2 claims
- 1133US5000156AMethod and device for dressing an inner peripheral blade in a slicing machineTOKYO SEIMITSU CO LTD·Filed 1989·Granted Mar 19, 1991·5 cites·9 claims
- 1229US5524604AMethod and apparatus for slicing semiconductor wafersTOKYO SEIMITSU CO LTD·Filed 1993·Granted Jun 11, 1996·2 cites·21 claims
- 1323US4838238AInternal peripheral edge type blade holding deviceTOKYO SEIMITSU CO LTD·Filed 1988·Granted Jun 13, 1989·1 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →