Inventor · disambiguated record
Jin-Chuan Bai
Also filed as: BAI JIN · BAI JIN-CHUAN
13 granted patents·10 pending applications·457 citations·filing 1998–2016
92Inventor score
Top patents by PatentIndex Score
23 records- 0190US6459163B1Semiconductor device and method for fabricating the sameUNITED TEST CT INC·Filed 2001·Granted Oct 1, 2002·51 cites·10 claims
- 0287US6790712B2Semiconductor device and method for fabricating the sameUNITED TEST CT INC·Filed 2002·Granted Sep 14, 2004·36 cites·9 claims
- 0377US6685639B1High intensity focused ultrasound system for scanning and curing tumorCHONGQING HIFU·Filed 1998·Granted Feb 3, 2004·330 cites·24 claims
- 0459US6964888B2Semiconductor device and method for fabricating the sameULTRATERA CORP·Filed 2004·Granted Nov 15, 2005·5 cites·9 claims
- 0558US6822337B2Window-type ball grid array semiconductor packageULTRATERA CORP·Filed 2002·Granted Nov 23, 2004·9 cites·12 claims
- 0652US6968613B2Fabrication method of circuit boardULTRATERA CORP·Filed 2002·Granted Nov 29, 2005·4 cites·11 claims
- 0751US8251929B2Integrated ultrasound therapy transducer assemblyZHAO CHUNLIANG·Filed 2005·Granted Aug 28, 2012·1 cites·7 claims
- 0851US6740540B2Fabrication method for circuit boardULTRA TERA CORP·Filed 2002·Granted May 25, 2004·4 cites·22 claims
- 0951US6710434B1Window-type semiconductor package and fabrication method thereofULTRATERA CORP·Filed 2002·Granted Mar 23, 2004·5 cites·7 claims
- 1050US9728812B2Electrostatic energy storage device and preparation method thereofBAI JIN·Filed 2013·Granted Aug 8, 2017·0 cites·8 claims
- 1150US6859056B2Test fixture for semiconductor package and test method of using the sameULTRATERA CORP·Filed 2002·Granted Feb 22, 2005·7 cites·12 claims
- 1250US6531333B2Chip photoelectric sensor assembly and method for making sameFiled 2001·Granted Mar 11, 2003·5 cites·6 claims
- 1338US2008281252A1Apparatus for Body Cavity Delivery with Medium, Body Cavity Leading-in and Ultrasound BlockCHONGQING HAIFU HIFU TECH CO·Filed 2005·Application pending·0 cites
- 1438US2003020183A1Semiconductor device without use of chip carrier and method for making the sameFiled 2002·Application pending·0 cites
- 1538US2003184979A1Circuit board free of photo-sensitive material and fabrication method of the sameULTRATERA CORP·Filed 2002·Application pending·0 cites
- 1638US2004003940A1Circuit board for flip-chip semiconductor package and fabrication method thereofFiled 2002·Application pending·0 cites
- 1737US2002041039A1Semiconductor device without use of chip carrier and method for making the sameUNITED TEST CT INC·Filed 2001·Application pending·0 cites
- 1835US2004004277A1Semiconductor package with reinforced substrate and fabrication method of the substrateFiled 2002·Application pending·0 cites
- 1935US2004061222A1Window-type ball grid array semiconductor packageFiled 2002·Application pending·0 cites
- 2034US2002187591A1Packaging process for semiconductor packageUNITED TEST CT INC·Filed 2001·Application pending·0 cites
- 2134US2002153581A1Chip photoelectric sensor assembly and method for making sameFiled 2000·Application pending·0 cites
- 2233US10355314B2Electrostatic energy storage device and preparation method thereofBAI JIN·Filed 2016·Granted Jul 16, 2019·0 cites·2 claims
- 2333US2004004281A1Semiconductor package with heat sinkFiled 2002·Application pending·0 cites
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