Inventor · disambiguated record
Yoke Kuin Tang
Also filed as: TANG YOKE KUIN
3 granted patents·155 citations·filing 2002–2003
75Inventor score
Technology areasH10W
Files withMICRON TECHNOLOGY INC3
Top patents by PatentIndex Score
3 records- 0193US6720666B2BOC BGA package for die with I-shaped bond pad layoutMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 13, 2004·91 cites·53 claims
- 0288US6692987B2BOC BGA package for die with I-shaped bond pad layoutMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 17, 2004·60 cites·74 claims
- 0350US7112048B2BOC BGA package for die with I-shaped bond pad layoutMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 26, 2006·4 cites·33 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →