Inventor · disambiguated record
Yong Kian Tan
Also filed as: TAN YONG KIAN
9 granted patents·189 citations·filing 2002–2008
89Inventor score
Files withMICRON TECHNOLOGY INC9
Top patents by PatentIndex Score
9 records- 0193US6720666B2BOC BGA package for die with I-shaped bond pad layoutMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 13, 2004·91 cites·53 claims
- 0288US6692987B2BOC BGA package for die with I-shaped bond pad layoutMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 17, 2004·60 cites·74 claims
- 0381US7190074B2Reconstructed semiconductor wafers including alignment droplets contacting alignment viasMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 13, 2007·5 cites·6 claims
- 0480US7071012B2Methods relating to the reconstruction of semiconductor wafers for wafer-level processingMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 4, 2006·17 cites·23 claims
- 0571US7425462B2Methods relating to the reconstruction of semiconductor wafers for wafer-level processingMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 16, 2008·2 cites·16 claims
- 0666US7820459B2Methods relating to the reconstruction of semiconductor wafers for wafer level processing including forming of alignment protrusion and removal of alignment materialMICRON TECHNOLOGY INC·Filed 2008·Granted Oct 26, 2010·1 cites·13 claims
- 0759US6856155B2Methods and apparatus for testing and burn-in of semiconductor devicesMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 15, 2005·9 cites·28 claims
- 0852US7573006B2Apparatus relating to the reconstruction of semiconductor wafers for wafer-level processingMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 11, 2009·0 cites·20 claims
- 0950US7112048B2BOC BGA package for die with I-shaped bond pad layoutMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 26, 2006·4 cites·33 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →