Inventor · disambiguated record
Saat Shukri Embong
Also filed as: EMBONG SAAT SHUKRI · EMBONG SAAT SHUKRI B
6 granted patents·2 pending applications·254 citations·filing 1999–2007
83Inventor score
Top patents by PatentIndex Score
8 records- 0192US5973388ALeadframe, method of manufacturing a leadframe, and method of packaging an electronic component utilizing the leadframeMOTOROLA INC·Filed 1999·Granted Oct 26, 1999·205 cites·7 claims
- 0271US6475834B2Method of manufacturing a semiconductor component and semiconductor component thereofSEMICONDUCTOR COMPONENTS IND·Filed 2000·Granted Nov 5, 2002·23 cites·20 claims
- 0364US6479893B2Ball-less clip bondingSEMICONDUCTOR COMPONENTS IND·Filed 2000·Granted Nov 12, 2002·18 cites·3 claims
- 0446US6436736B1Method for manufacturing a semiconductor package on a leadframeSEMICONDUCTOR COMPONENTS IND·Filed 2000·Granted Aug 20, 2002·5 cites·6 claims
- 0539US6588098B1Method for manufacturing an electronic device packageSEMICONDUCTOR COMPONENTS IND·Filed 2000·Granted Jul 8, 2003·2 cites·3 claims
- 0639US6376266B1Semiconductor package and method for forming sameSEMICONDUCTOR COMPONENTS IND·Filed 2000·Granted Apr 23, 2002·1 cites·16 claims
- 0739US2006103008A1Hyper thermally enhanced semiconductor package systemSTATS CHIPPAC LTD·Filed 2005·Application pending·0 cites
- 0832US2009042339A1Packaged integrated circuits and methods to form a packaged integrated circuitTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
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