Inventor · disambiguated record
Myungkee Chung
Also filed as: CHUNG MYUNGKEE
10 granted patents·2 pending applications·9 citations·filing 2019–2024
81Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD12
Top patents by PatentIndex Score
12 records- 0186US11362054B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 14, 2022·2 cites·19 claims
- 0285US11581234B2Semiconductor package with improved heat dissipationSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 14, 2023·2 cites·19 claims
- 0383US11296004B2Semiconductor package including heat redistribution layersSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 5, 2022·4 cites·12 claims
- 0478US11705418B2Semiconductor package with conductive bump on conductive post including an intermetallic compound layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 18, 2023·1 cites·20 claims
- 0574US2025105217A1Semiconductor package, and a package on package type semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0666US12341074B2Semiconductor package with increased thermal dissipationSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 24, 2025·0 cites·19 claims
- 0766US12009328B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 11, 2024·0 cites·20 claims
- 0863US12166013B2Semiconductor package, and a package on package type semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 10, 2024·0 cites·20 claims
- 0951US11430772B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 30, 2022·0 cites·20 claims
- 1050US11488937B2Semiconductor package with stack structure and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 1, 2022·0 cites·20 claims
- 1148US12154889B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 26, 2024·0 cites·20 claims
- 1244US2021167007A1Redistribution structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →