Inventor · disambiguated record

Mohd Kahar Bajuri

Also filed as: BAJURI MOHD KAHAR

5 granted patents·2 pending applications·1 citations·filing 2017–2025

62Inventor score

Technology areasH10W

Files withINFINEON TECHNOLOGIES AG7

Top patents by PatentIndex Score

7 records

0170US12205874B2Semiconductor package with wire bond jointsINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
0260US11842953B2Semiconductor package with wire bond joints and related methods of manufacturingINFINEON TECHNOLOGIES AG·Filed 2021·Granted Dec 12, 2023·0 cites·18 claims
0359US10083899B2Semiconductor package with heat slug and rivet free die attach areaINFINEON TECHNOLOGIES AG·Filed 2017·Granted Sep 25, 2018·1 cites·14 claims
0449US2025385220A1Method of forming an electrical connection and electrical connectionINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
0547US2025286012A1Semiconductor package having a ball-bond interconnect structure and related methods of manufacturingINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
0646US11211353B2Clips for semiconductor packagesINFINEON TECHNOLOGIES AG·Filed 2019·Granted Dec 28, 2021·0 cites·24 claims
0739US11705387B2Multi-layer interconnection ribbonINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 18, 2023·0 cites·17 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →