Inventor · disambiguated record
Jirou Sugiyama
Also filed as: SUGIYAMA JIROU
6 granted patents·4 pending applications·7 citations·filing 2016–2018
71Inventor score
Files withFURUKAWA ELECTRIC CO LTD10
Top patents by PatentIndex Score
10 records- 0184US10689550B2Electrically conductive compositionFURUKAWA ELECTRIC CO LTD·Filed 2017·Granted Jun 23, 2020·5 cites·13 claims
- 0266US11066577B2Electrically conductive adhesive film and dicing-die bonding film using the sameFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Jul 20, 2021·1 cites·13 claims
- 0364US11230649B2Electrically conductive adhesive film and dicing-die bonding film using the sameFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Jan 25, 2022·1 cites·12 claims
- 0449US2018294242A1Electrically conductive adhesive film and dicing die bonding filmFURUKAWA ELECTRIC CO LTD·Filed 2018·Application pending·0 cites
- 0544US2018026003A1Electrically conductive adhesive film and dicing die bonding filmFURUKAWA ELECTRIC CO LTD·Filed 2016·Application pending·0 cites
- 0643US11136479B2Electrically conductive adhesive film and dicing-die bonding film using the sameFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Oct 5, 2021·0 cites·11 claims
- 0742US11306225B2Electrically conductive adhesive agent composition, and electrically conductive adhesive film and dicing-die-bonding film using the sameFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Apr 19, 2022·0 cites·12 claims
- 0841US11193047B2Electrically conductive adhesive film and dicing-die bonding film using the sameFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Dec 7, 2021·0 cites·11 claims
- 0935US2018190532A1Film for semiconductor back surfaceFURUKAWA ELECTRIC CO LTD·Filed 2018·Application pending·0 cites
- 1034US2017152411A1Conductive adhesive filmFURUKAWA ELECTRIC CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →