Inventor · disambiguated record
Naoto Kimura
Also filed as: KIMURA NAOTO
48 granted patents·19 pending applications·780 citations·filing 1991–2025
98Inventor score
Top patents by PatentIndex Score
67 records- 0195US6218728B1Mold-BGA-type semiconductor device and method for making the sameNEC CORP·Filed 1998·Granted Apr 17, 2001·193 cites·4 claims
- 0290US6600221B2Semiconductor device with stacked semiconductor chipsNEC ELECTRONICS CORP·Filed 2001·Granted Jul 29, 2003·63 cites·2 claims
- 0385US9542734B2Information processing apparatus, image processing method, and storage medium that determine tone characteristics for respective object signalsCANON KK·Filed 2014·Granted Jan 10, 2017·6 cites·10 claims
- 0485US6744141B2Stacked chip-size package type semiconductor device capable of being decreased in sizeNEC ELECTRONICS CORP·Filed 2002·Granted Jun 1, 2004·40 cites·8 claims
- 0583US11817339B2Electrostatic chuck device and method for manufacturing sameSUMITOMO OSAKA CEMENT CO LTD·Filed 2019·Granted Nov 14, 2023·3 cites·10 claims
- 0683US10764468B2Image processing apparatus and image processing methodCANON KK·Filed 2018·Granted Sep 1, 2020·3 cites·6 claims
- 0783US7030505B2Resin-sealed-type semiconductor device, and production process for producing such semiconductor deviceNEC ELECTRONICS CORP·Filed 2003·Granted Apr 18, 2006·34 cites·34 claims
- 0883US6621156B2Semiconductor device having stacked multi chip module structureNEC ELECTRONICS CORP·Filed 2002·Granted Sep 16, 2003·34 cites·15 claims
- 0981US6476500B2Semiconductor deviceNEC CORP·Filed 2001·Granted Nov 5, 2002·33 cites·12 claims
- 1081US6028356APlastic-packaged semiconductor integrated circuitNEC CORP·Filed 1997·Granted Feb 22, 2000·55 cites·1 claims
- 1179US10628928B2Image processing apparatus, image processing method, and storage medium for gain adjustmentCANON KK·Filed 2018·Granted Apr 21, 2020·2 cites·10 claims
- 1278US11345639B2Composite sintered body, electrostatic chuck member, electrostatic chuck device, and method for producing composite sintered bodySUMITOMO OSAKA CEMENT CO LTD·Filed 2019·Granted May 31, 2022·2 cites·10 claims
- 1377US6984889B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2004·Granted Jan 10, 2006·17 cites·15 claims
- 1477US5663594ABall grid array type of semiconductor deviceNEC CORP·Filed 1995·Granted Sep 2, 1997·55 cites·10 claims
- 1577US2025347447A1Heat source unit and refrigeration apparatusDAIKIN IND LTD·Filed 2025·Application pending·0 cites
- 1676US9449376B2Image processing apparatus and image processing method for performing tone correction of an output imageCANON KK·Filed 2014·Granted Sep 20, 2016·4 cites·17 claims
- 1776US6734553B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2002·Granted May 11, 2004·17 cites·4 claims
- 1876US2025334310A1Heat source unit and refrigeration apparatusDAIKIN IND LTD·Filed 2025·Application pending·0 cites
- 1974US10043253B2Image processing device, image processing method, and programCANON KK·Filed 2016·Granted Aug 7, 2018·2 cites·12 claims
- 2074US7432588B2Semiconductor device and method of fabricating the sameNEC ELECTRONICS CORP·Filed 2005·Granted Oct 7, 2008·6 cites·6 claims
- 2173US5168805AScreen printing method and method of producing screen printing platesMURATA MANUFACTURING CO·Filed 1991·Granted Dec 8, 1992·32 cites·5 claims
- 2272US6690090B2Semiconductor device having reliable coupling with mounting substrateNEC ELECTRONICS CORP·Filed 2002·Granted Feb 10, 2004·18 cites·11 claims
- 2371US5962918ASemiconductor device having simple protective structure and process of fabrication thereofNEC CORP·Filed 1998·Granted Oct 5, 1999·39 cites·6 claims
- 2471US5715593AMethod of making plastic-packaged semiconductor integrated circuitNEC CORP·Filed 1997·Granted Feb 10, 1998·34 cites·10 claims
- 2569US6640436B1Method of fabricating a coated metallic wire, method of removing insulation from the coated metallic wire and method of fabricating a semiconductor device with the wireNEC ELECTRONICS CORP·Filed 2000·Granted Nov 4, 2003·13 cites·12 claims
- 2669US2025207830A1Heat source unit and refrigeration apparatusDAIKIN IND LTD·Filed 2025·Application pending·0 cites
- 2768US12085320B2Heat source unit and refrigeration apparatusDAIKIN IND LTD·Filed 2023·Granted Sep 10, 2024·0 cites·22 claims
- 2866US6933612B2Semiconductor device with improved heatsink structureNEC ELECTRONICS CORP·Filed 2003·Granted Aug 23, 2005·13 cites·13 claims
- 2966US2025164168A1Heat source unit and refrigeration apparatusDAIKIN IND LTD·Filed 2025·Application pending·0 cites
- 3065US6605869B2Semiconductor device with improved cooling efficiency and reduced electric resistanceNEC ELECTRONICS CORP·Filed 2002·Granted Aug 12, 2003·12 cites·6 claims
- 3165US2025225630A1Apparatus, image capturing apparatus, method, and storage mediumCANON KK·Filed 2024·Application pending·0 cites
- 3265US2025209582A1Image processing apparatus, image capturing apparatus, image processing method, and storage mediumCANON KK·Filed 2024·Application pending·0 cites
- 3362US12123629B2Heat source unit and refrigeration device having low-stage and high-stage compressors with four-way switching valveDAIKIN IND LTD·Filed 2023·Granted Oct 22, 2024·0 cites·19 claims
- 3462US7521778B2Semiconductor device and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2006·Granted Apr 21, 2009·2 cites·20 claims
- 3559US7705437B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2008·Granted Apr 27, 2010·1 cites·7 claims
- 3659US6575348B2Wire bonding apparatus with spurious vibration suppressing structureNEC ELECTRONICS CORP·Filed 2002·Granted Jun 10, 2003·9 cites·4 claims
- 3754US11551962B2Ceramic substrate and susceptorSUMITOMO OSAKA CEMENT CO LTD·Filed 2019·Granted Jan 10, 2023·0 cites·9 claims
- 3853US7944027B2Lead frame, semiconductor device, and method of manufacturing the semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2008·Granted May 17, 2011·0 cites·7 claims
- 3953US2022155090A1On-board device, voice information output method, and voice information output programJVCKENWOOD CORP·Filed 2022·Application pending·0 cites
- 4052US11477384B2Information processing apparatus, imaging apparatus, information processing method, control method for imaging apparatus, and storage medium for notifying of a subject blur occuring in a captured imageCANON KK·Filed 2019·Granted Oct 18, 2022·0 cites·20 claims
- 4152US8994846B2Image processing apparatus and image processing method for detecting displacement between images having different in-focus positionsCANON KK·Filed 2013·Granted Mar 31, 2015·0 cites·18 claims
- 4252US6472759B1Ball grid array type semiconductor deviceNEC CORP·Filed 2000·Granted Oct 29, 2002·5 cites·7 claims
- 4351US6239376B1Coated fine metallic wire and method for fabricating semiconductor device using sameNEC CORP·Filed 1998·Granted May 29, 2001·14 cites·9 claims
- 4449US11743573B2Imaging apparatus for adjusting photographing conditions according to photographed images and method for controlling imaging apparatusCANON KK·Filed 2021·Granted Aug 29, 2023·0 cites·17 claims
- 4548US12074050B2Composite sintered body, electrostatic chuck member, electrostatic chuck device, and method for producing composite sintered bodySUMITOMO OSAKA CEMENT CO LTD·Filed 2018·Granted Aug 27, 2024·0 cites·14 claims
- 4648US11341622B2Image processing apparatus, image capturing apparatus, image processing method, and storage mediumCANON KK·Filed 2020·Granted May 24, 2022·0 cites·11 claims
- 4748US2022120480A1Refrigeration apparatus-use unit, heat source unit, utilization unit, and refrigeration apparatusDAIKIN IND LTD·Filed 2021·Application pending·0 cites
- 4847US10313649B2Image processing apparatus, control method thereof, and storage mediumCANON KK·Filed 2017·Granted Jun 4, 2019·0 cites·15 claims
- 4947US2014218559A1Image pickup apparatus, image processing apparatus, control method for image pickup apparatus, and image processing methodCANON KK·Filed 2014·Application pending·0 cites
- 5046US11072534B2Diiodosilane producing methodYAMANAKA HUTECH CORP·Filed 2019·Granted Jul 27, 2021·0 cites·8 claims
Showing the top 50 of 67 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →