Inventor · disambiguated record
Hideyuki Kokaji
Also filed as: KOKAJI HIDEYUKI
3 granted patents·2 pending applications·0 citations·filing 2007–2017
42Inventor score
Top patents by PatentIndex Score
5 records- 0156US9375905B2Bonded member manufacturing apparatus and method of manufacturing bonded memberORIGIN ELECTRIC·Filed 2012·Granted Jun 28, 2016·0 cites·11 claims
- 0255US10322547B2Bonded member manufacturing apparatus and method of manufacturing bonded memberORIGIN CO LTD·Filed 2016·Granted Jun 18, 2019·0 cites·20 claims
- 0354US2014158291A1Method for manufacturing bonded memberORIGIN ELECTRIC·Filed 2013·Application pending·0 cites
- 0444US11364518B2Joined member manufacturing apparatus, method for manufacturing joined member, and method for manufacturing member on which applied material has been appliedORIGIN ELECTRIC·Filed 2017·Granted Jun 21, 2022·0 cites·8 claims
- 0539US2009029063A1Resin Film Forming Device, Method and Program of the SameKOKAJI HIDEYUKI·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →