Inventor · disambiguated record
Diong Hing Ding
Also filed as: DING DIONG H · DING DIONG-HING
4 granted patents·27 citations·filing 2000–2020
72Inventor score
Top patents by PatentIndex Score
4 records- 0171US7601612B1Method for forming solder joints for a flip chip assemblyGLOBALFOUNDRIES INC·Filed 2005·Granted Oct 13, 2009·5 cites·17 claims
- 0264US6409070B1Minimizing flux residue by controlling amount of moisture during reflowADVANCED MICRO DEVICES INC·Filed 2000·Granted Jun 25, 2002·14 cites·14 claims
- 0358US6632690B2Method of fabricating reliable laminate flip-chip assemblyADVANCED MICRO DEVICES INC·Filed 2002·Granted Oct 14, 2003·8 cites·8 claims
- 0434US11450732B2Structure for capacitor protection, package structure, and method of forming package structureSUZHOU TF AMD SEMICONDUCTOR CO LTD·Filed 2020·Granted Sep 20, 2022·0 cites·20 claims
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