Inventor · disambiguated record
Sung Bum Kim
Also filed as: KIM SUNG BUM
9 granted patents·4 pending applications·98 citations·filing 1995–2023
88Inventor score
Files withESSEN TECH CO LTD4SAMSUNG ELECTRONICS CO LTD4MEDY TOX INC2DAEWOO ELECTRONICS CO LTD1JUNG HYUN HO1
Top patents by PatentIndex Score
13 records- 0193US8920795B2Lyophilized preparation of botulinum toxinJUNG HYUN HO·Filed 2012·Granted Dec 30, 2014·26 cites·14 claims
- 0292US9198958B2Lyophilized preparation of botulinum toxinMEDY TOX INC·Filed 2014·Granted Dec 1, 2015·16 cites·17 claims
- 0384USD1005451SBall valveESSEN TECH CO LTD·Filed 2021·Granted Nov 21, 2023·9 cites·1 claims
- 0472US7336951B2System and method for performing handover in mobile communication system using paging procedureSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Feb 26, 2008·20 cites·14 claims
- 0567USD1006191SBall valveESSEN TECH CO LTD·Filed 2021·Granted Nov 28, 2023·3 cites·1 claims
- 0666USD1006088SSight glassESSEN TECH CO LTD·Filed 2021·Granted Nov 28, 2023·3 cites·1 claims
- 0761USD1006089SSight glassESSEN TECH CO LTD·Filed 2021·Granted Nov 28, 2023·2 cites·1 claims
- 0857US2009106886A1Automatic hinge module and apparatus having the same for opening and closing toilet bowlSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0955US5749248AWashing machine having a detachable washing bucketDAEWOO ELECTRONICS CO LTD·Filed 1995·Granted May 12, 1998·17 cites·8 claims
- 1054US2023335476A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1154US2023076184A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1251US7248569B2Method and system for disconnecting a terminating connection leg (leg2) for enhanced dialed services in a mobile intelligent networkSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jul 24, 2007·2 cites·22 claims
- 1348US2016089442A1Lyophilized Preparation of Botulinum ToxinMEDY TOX INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →