Inventor · disambiguated record
Craig Amrine
Also filed as: AMRINE CRAIG · AMRINE CRAIG S
20 granted patents·3 pending applications·795 citations·filing 1996–2008
96Inventor score
Files withMOTOROLA INC11FREESCALE SEMICONDUCTOR INC7AMRINE CRAIG1FREESCALE SEMICONUCTOR INC1GAO WEI1
Top patents by PatentIndex Score
23 records- 0197US7405102B2Methods and apparatus for thermal management in a multi-layer embedded chip structureFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Jul 29, 2008·69 cites·12 claims
- 0296US7741151B2Integrated circuit package formationFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Jun 22, 2010·54 cites·20 claims
- 0393US7015075B2Die encapsulation using a porous carrierFREESCALE SEMICONUCTOR INC·Filed 2004·Granted Mar 21, 2006·200 cites·34 claims
- 0493US6953985B2Wafer level MEMS packagingFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Oct 11, 2005·127 cites·29 claims
- 0592US5717287ASpacers for a flat panel display and methodMOTOROLA INC·Filed 1996·Granted Feb 10, 1998·86 cites·19 claims
- 0690US7442581B2Flexible carrier and release method for high volume electronic package fabricationFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Oct 28, 2008·54 cites·25 claims
- 0781US7969026B2Flexible carrier for high volume electronic package fabricationFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Jun 28, 2011·8 cites·16 claims
- 0881US5708325ADisplay spacer structure for a field emission deviceMOTOROLA INC·Filed 1996·Granted Jan 13, 1998·36 cites·17 claims
- 0979US6149484AMethod of making field emission display having a mechanical support/getter assemblyMOTOROLA INC·Filed 1998·Granted Nov 21, 2000·30 cites·10 claims
- 1079US5980346AMethod for fabricating a display spacer assemblyMOTOROLA INC·Filed 1997·Granted Nov 9, 1999·30 cites·14 claims
- 1179US5945780ANode plate for field emission displayMOTOROLA INC·Filed 1997·Granted Aug 31, 1999·34 cites·35 claims
- 1277US6459198B1Seal and method of sealing devices such as displaysMOTOROLA INC·Filed 2000·Granted Oct 1, 2002·16 cites·20 claims
- 1374US9142434B2Method for singulating electronic components from a substrateGAO WEI·Filed 2008·Granted Sep 22, 2015·4 cites·7 claims
- 1465US5894193AField emission display with getter frame and spacer-frame assemblyMOTOROLA INC·Filed 1997·Granted Apr 13, 1999·15 cites·7 claims
- 1562US8236609B2Packaging an integrated circuit die with backside metallizationRAMANATHAN LAKSHMI N·Filed 2008·Granted Aug 7, 2012·3 cites·16 claims
- 1662US7802359B2Electronic assembly manufacturing methodFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Sep 28, 2010·2 cites·19 claims
- 1750US6042445AMethod for affixing spacers in a field emission displayMOTOROLA INC·Filed 1999·Granted Mar 28, 2000·8 cites·23 claims
- 1847US6366009B1Method for fabricating a field emission display having a spacer with a passivation layerMOTOROLA INC·Filed 1999·Granted Apr 2, 2002·7 cites·29 claims
- 1946US5990613AField emission device having a non-coated spacerMOTOROLA INC·Filed 1998·Granted Nov 23, 1999·7 cites·20 claims
- 2043US6114802AField emission device having stamped substrate and methodMOTOROLA INC·Filed 1997·Granted Sep 5, 2000·5 cites·10 claims
- 2143US2008182363A1Method for forming a microelectronic assembly including encapsulating a die using a sacrificial layerFREESCALE SEMICONDUCTOR INC·Filed 2007·Application pending·0 cites
- 2242US2007212865A1Method for planarizing vias formed in a substrateAMRINE CRAIG·Filed 2006·Application pending·0 cites
- 2331US2004016995A1MEMS control chip integrationFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →