Inventor · disambiguated record
Toshihisa Isono
Also filed as: ISONO TOSHIHISA
7 granted patents·4 pending applications·36 citations·filing 2005–2012
79Inventor score
Top patents by PatentIndex Score
11 records- 0194US7220347B2Electrolytic copper plating bath and plating process therewithUYEMURA C & CO LTD·Filed 2005·Granted May 22, 2007·27 cites·20 claims
- 0282US9028668B2Electrolytic copper plating bath and method for electroplating using the electrolytic copper plating bathISONO TOSHIHISA·Filed 2010·Granted May 12, 2015·3 cites·16 claims
- 0377US7988842B2Continuous copper electroplating methodUYEMURA C & CO LTD·Filed 2008·Granted Aug 2, 2011·2 cites·4 claims
- 0475US7892411B2Electrolytic copper plating processUYEMURA C & CO LTD·Filed 2008·Granted Feb 22, 2011·1 cites·4 claims
- 0567US8679317B2Copper electroplating bathISONO TOSHIHISA·Filed 2007·Granted Mar 25, 2014·3 cites·6 claims
- 0650US2009092749A1Manufacture method of buildup circuit boardUYEMURA C & CO LTD·Filed 2008·Application pending·0 cites
- 0749US8801912B2Continuous copper electroplating methodOMURA NAOYUKI·Filed 2009·Granted Aug 12, 2014·0 cites·4 claims
- 0847US2013056362A1Manufacture method of buildup circuit boardUYEMURA AND CO LTD C·Filed 2012·Application pending·0 cites
- 0944US9730337B2Plating methodISONO TOSHIHISA·Filed 2012·Granted Aug 8, 2017·0 cites·4 claims
- 1038US2011056840A1Electrolytic plating equipment and electrolytic plating methodUYEMURA C & CO LTD·Filed 2010·Application pending·0 cites
- 1136US2011089044A1Copper electrolytic plating bath and copper electrolytic plating methodUYEMURA C & CO LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →