Inventor · disambiguated record
Koichi Shibayama
Also filed as: SHIBAYAMA KOICHI
10 granted patents·11 pending applications·114 citations·filing 1992–2012
88Inventor score
Files withSEKISUI CHEMICAL CO LTD14ISHIDA HATSUO1IWADE TETSUNARI1KOBAYASHI TAKAYUKI1SHIBAYAMA KOICHI1
Top patents by PatentIndex Score
21 records- 0191US6924334B1Polyolefin resin compositionSEKISUI CHEMICAL CO LTD·Filed 2000·Granted Aug 2, 2005·40 cites·19 claims
- 0277US5304580AExpandable polyolefin resin compositionsSEKISUI CHEMICAL CO LTD·Filed 1992·Granted Apr 19, 1994·30 cites·9 claims
- 0358US7682691B2Resin composition of layered silicateSEKISUI CHEMICAL CO LTD·Filed 2003·Granted Mar 23, 2010·9 cites·24 claims
- 0455US2009267263A1Thermosetting resin composition, material for substrate and film for substrateSEKISUI CHEMICAL CO LTD·Filed 2009·Application pending·0 cites
- 0555US2009256283A1Thermoplastic resin composition, material for substrate and film for substrateSEKISUI CHEMICAL CO LTD·Filed 2009·Application pending·0 cites
- 0654US7754803B2Resin compositionSEKISUI CHEMICAL CO LTD·Filed 2003·Granted Jul 13, 2010·6 cites·31 claims
- 0751US9120293B2Preliminary-cured material, roughened preliminary-cured material, and laminated bodyYOKOTA REONA·Filed 2011·Granted Sep 1, 2015·2 cites·6 claims
- 0851US6906119B1Thermoplastic foam and method for production thereofSEKISUI CHEMICAL CO LTD·Filed 2000·Granted Jun 14, 2005·2 cites·7 claims
- 0951US2007148442A1Thermosetting resin composition, material for substrate and film for substrateSEKISUI CHEMICAL CO LTD·Filed 2004·Application pending·0 cites
- 1050US2008268237A1Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polyimide film for tab, and prepregSEKISUI CHEMICAL CO LTD·Filed 2008·Application pending·0 cites
- 1150US2008268257A1Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polymide film, film for tab, and prepregSEKISUI CHEMICAL CO LTD·Filed 2008·Application pending·0 cites
- 1249US7173068B2Thermoplastic foam and method for production thereofSEKISUI CHEMICAL CO LTD·Filed 2004·Granted Feb 6, 2007·0 cites·7 claims
- 1347US6433130B1Process for preparing polymer by using copper compoundSEKISUI CHEMICAL CO LTD·Filed 2001·Granted Aug 13, 2002·1 cites·19 claims
- 1447US6256644B1Control system for storing data in accordance with predefined characteristics thereofFiled 1998·Granted Jul 3, 2001·23 cites·7 claims
- 1545US2013337229A1Roughed cured material and laminatedKOBAYASHI TAKAYUKI·Filed 2012·Application pending·0 cites
- 1642US2007072963A1Thermoplastic resin composition, material for substrate and film for substrateSHIBAYAMA KOICHI·Filed 2004·Application pending·0 cites
- 1741US2011003914A1Resin composition and multilayer resin film employing the sameSEKISUI CHEMICAL CO LTD·Filed 2009·Application pending·0 cites
- 1841US2007191555A1Thermosetting resin composition and its articleISHIDA HATSUO·Filed 2004·Application pending·0 cites
- 1939US7709085B2Thermosetting resin composition, resin sheet and resin sheet for insulated substrateSEKISUI CHEMICAL CO LTD·Filed 2004·Granted May 4, 2010·1 cites·11 claims
- 2037US2005260404A1Sheet-form moldingIWADE TETSUNARI·Filed 2001·Application pending·0 cites
- 2136US2004053061A1Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polymidefilm, film for tab, and prepregFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →