Inventor · disambiguated record
Dennis Lang
Also filed as: LANG DENNIS · LANG DENNIS R
6 granted patents·3 pending applications·152 citations·filing 1988–2011
83Inventor score
Top patents by PatentIndex Score
9 records- 0191US6674157B2Semiconductor package comprising vertical power transistorFAIRCHILD SEMICONDUCTOR·Filed 2001·Granted Jan 6, 2004·106 cites·19 claims
- 0279US7390698B2Packaged semiconductor device and method of manufacture using shaped dieFAIRCHILD SEMICONDUCTOR·Filed 2006·Granted Jun 24, 2008·8 cites·17 claims
- 0365US8030764B2High temperature operating package and circuit designFAIRCHILD SEMICONDUCTOR·Filed 2009·Granted Oct 4, 2011·2 cites·12 claims
- 0462US7084488B2Packaged semiconductor device and method of manufacture using shaped dieFAIRCHILD SEMICONDUCTOR·Filed 2002·Granted Aug 1, 2006·10 cites·12 claims
- 0554US4883080ACombination nozzle and dental floss assembly for oral hygiene flushing apparatusLANG DENNIS R·Filed 1988·Granted Nov 28, 1989·26 cites·7 claims
- 0644US8803239B2High temperature operating package and circuit designTHORNTON NEILL·Filed 2011·Granted Aug 12, 2014·0 cites·6 claims
- 0742US2008054461A1Reliable wafer-level chip-scale package solder bump structure in a packaged semiconductor deviceLANG DENNIS·Filed 2007·Application pending·0 cites
- 0841US2008054496A1High temperature operating package and circuit designTHORNTON NEILL·Filed 2006·Application pending·0 cites
- 0934US2010117231A1Reliable wafer-level chip-scale solder bump structureLANG DENNIS·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →