Inventor · disambiguated record
Namiki Moriga
Also filed as: MORIGA NAMIKI
8 granted patents·1 pending application·45 citations·filing 1991–2006
82Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0153US5394014ASemiconductor device improved in light shielding property and light shielding packageMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Feb 28, 1995·18 cites·8 claims
- 0253US5317195ASemiconductor device improved in light shielding property and light shielding packageMITSUBISHI ELECTRIC CORP·Filed 1991·Granted May 31, 1994·19 cites·19 claims
- 0348US7510958B2Method of manufacturing a semiconductor device including a bump forming processRENESAS TECH CORP·Filed 2006·Granted Mar 31, 2009·0 cites·6 claims
- 0446US7153764B2Method of manufacturing a semiconductor device including a bump forming processRENESAS TECH CORP·Filed 2004·Granted Dec 26, 2006·2 cites·2 claims
- 0535US6600218B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Jul 29, 2003·0 cites·17 claims
- 0632US2002149121A1Base interconnection substrate, manufacturing method thereof, semiconductor device and manfacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2001·Application pending·0 cites
- 0730US5977628ASemiconductor device mounted in resin sealed containerMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Nov 2, 1999·5 cites·2 claims
- 0827US5323058ASemiconductor device including package with improved base-to-cop sealMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Jun 21, 1994·1 cites·5 claims
- 0926US6602738B2Method of manufacturing semiconductor device having tie bars for interconnecting leadsMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Aug 5, 2003·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →