Inventor · disambiguated record
Padmanabhan Krishnaraj
Also filed as: KRISHNARAJ PADMANABHAN
26 granted patents·3 pending applications·2,525 citations·filing 1996–2007
97Inventor score
Files withAPPLIED MATERIALS INC29
Top patents by PatentIndex Score
29 records- 0199US7399388B2Sequential gas flow oxide deposition techniqueAPPLIED MATERIALS INC·Filed 2003·Granted Jul 15, 2008·622 cites·28 claims
- 0299US6863019B2Semiconductor device fabrication chamber cleaning method and apparatus with recirculation of cleaning gasAPPLIED MATERIALS INC·Filed 2002·Granted Mar 8, 2005·608 cites·6 claims
- 0398US6869880B2In situ application of etch back for improved deposition into high-aspect-ratio featuresAPPLIED MATERIALS INC·Filed 2002·Granted Mar 22, 2005·241 cites·13 claims
- 0497US6189483B1Process kitAPPLIED MATERIALS INC·Filed 1997·Granted Feb 20, 2001·341 cites·23 claims
- 0596US7081414B2Deposition-selective etch-deposition process for dielectric film gapfillAPPLIED MATERIALS INC·Filed 2003·Granted Jul 25, 2006·98 cites·9 claims
- 0694US7722737B2Gas distribution system for improved transient phase depositionAPPLIED MATERIALS INC·Filed 2005·Granted May 25, 2010·23 cites·10 claims
- 0793US6143078AGas distribution system for a CVD processing chamberAPPLIED MATERIALS INC·Filed 1998·Granted Nov 7, 2000·147 cites·29 claims
- 0891US7097886B2Deposition process for high aspect ratio trenchesAPPLIED MATERIALS INC·Filed 2002·Granted Aug 29, 2006·56 cites·19 claims
- 0991US6486081B1Gas distribution system for a CVD processing chamberAPPLIED MATERIALS INC·Filed 1999·Granted Nov 26, 2002·124 cites·51 claims
- 1086US6274058B1Remote plasma cleaning method for processing chambersAPPLIED MATERIALS INC·Filed 1999·Granted Aug 14, 2001·106 cites·21 claims
- 1180US6633076B2Methods and apparatus for producing stable low k FSG film for HDP-CVDAPPLIED MATERIALS INC·Filed 2002·Granted Oct 14, 2003·24 cites·13 claims
- 1279US6511922B2Methods and apparatus for producing stable low k FSG film for HDP-CVDAPPLIED MATERIALS INC·Filed 2001·Granted Jan 28, 2003·22 cites·16 claims
- 1377US7799698B2Deposition-selective etch-deposition process for dielectric film gapfillAPPLIED MATERIALS INC·Filed 2006·Granted Sep 21, 2010·4 cites·19 claims
- 1474US7691753B2Deposition-selective etch-deposition process for dielectric film gapfillAPPLIED MATERIALS INC·Filed 2006·Granted Apr 6, 2010·3 cites·18 claims
- 1573US7141138B2Gas delivery system for semiconductor processingAPPLIED MATERIALS INC·Filed 2003·Granted Nov 28, 2006·13 cites·16 claims
- 1673US6596123B1Method and apparatus for cleaning a semiconductor wafer processing systemAPPLIED MATERIALS INC·Filed 2000·Granted Jul 22, 2003·15 cites·13 claims
- 1772US7399707B2In situ application of etch back for improved deposition into high-aspect-ratio featuresAPPLIED MATERIALS INC·Filed 2005·Granted Jul 15, 2008·3 cites·7 claims
- 1872US6812153B2Method for high aspect ratio HDP CVD gapfillAPPLIED MATERIALS INC·Filed 2002·Granted Nov 2, 2004·13 cites·7 claims
- 1971US7189639B2Use of germanium dioxide and/or alloys of GeO2 with silicon dioxide for semiconductor dielectric applicationsAPPLIED MATERIALS INC·Filed 2005·Granted Mar 13, 2007·3 cites·32 claims
- 2070US7431772B2Gas distributor having directed gas flow and cleaning methodAPPLIED MATERIALS INC·Filed 2004·Granted Oct 7, 2008·11 cites·16 claims
- 2168US6715496B2Method and apparatus for cleaning a semiconductor wafer processing systemAPPLIED MATERIALS INC·Filed 2003·Granted Apr 6, 2004·10 cites·12 claims
- 2267US6635144B2Apparatus and method for detecting an end point of chamber cleaning in semiconductor equipmentAPPLIED MATERIALS INC·Filed 2001·Granted Oct 21, 2003·11 cites·8 claims
- 2364US6890597B2HDP-CVD uniformity controlAPPLIED MATERIALS INC·Filed 2003·Granted May 10, 2005·6 cites·22 claims
- 2463US7498268B2Gas delivery system for semiconductor processingAPPLIED MATERIALS INC·Filed 2006·Granted Mar 3, 2009·1 cites·9 claims
- 2562US2008041821A1Gas Distribution System for Improved Transient Phase DepositionAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 2660US6175485B1Electrostatic chuck and method for fabricating the sameAPPLIED MATERIALS INC·Filed 1996·Granted Jan 16, 2001·18 cites·45 claims
- 2750US7064077B2Method for high aspect ratio HDP CVD gapfillAPPLIED MATERIALS INC·Filed 2004·Granted Jun 20, 2006·2 cites·20 claims
- 2839US2004231798A1Gas delivery system for semiconductor processingAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 2938US2005214457A1Deposition of low dielectric constant films by N2O additionAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
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