Inventor · disambiguated record
Yang Gyoo Jung
Also filed as: JUNG YANG GYOO
9 granted patents·1 pending application·22 citations·filing 2015–2025
83Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0193US9916989B2System and method for laser assisted bonding of semiconductor dieAMKOR TECHNOLOGY INC·Filed 2016·Granted Mar 13, 2018·11 cites·20 claims
- 0292US10304698B2System and method for laser assisted bonding of semiconductor dieAMKOR TECHNOLOGY INC·Filed 2018·Granted May 28, 2019·7 cites·23 claims
- 0387US10763129B2System and method for laser assisted bonding of an electronic deviceAMKOR TECHNOLOGY INC·Filed 2019·Granted Sep 1, 2020·3 cites·15 claims
- 0487US2025372399A1System and method for laser assisted bonding of an electronic deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 0583US12374558B2Laser-assisted bonding apparatus for bonding an electronic device to a substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jul 29, 2025·0 cites·19 claims
- 0671US11742216B2System and method for laser assisted bonding of an electronic deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Aug 29, 2023·0 cites·16 claims
- 0760US11664331B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 30, 2023·0 cites·20 claims
- 0859US9627348B2Laser assisted bonding for semiconductor die interconnectionsAMKOR TECHNOLOGY INC·Filed 2015·Granted Apr 18, 2017·1 cites·17 claims
- 0949US11217503B2Semiconductor package having logic semiconductor chip and memory packages on interposerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 4, 2022·0 cites·19 claims
- 1047US11139253B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 5, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →