Inventor · disambiguated record
Robert Hartmann
Also filed as: HARTMANN ROBERT · HARTMANN ROBERT C
7 granted patents·2 pending applications·27 citations·filing 2010–2019
79Inventor score
Top patents by PatentIndex Score
9 records- 0191US9269887B1Ultrathin flip-chip packaging techniques and configurationsTRIQUINT SEMICONDUCTOR INC·Filed 2015·Granted Feb 23, 2016·17 cites·25 claims
- 0277US9646857B2Low pressure encapsulant for size-reduced semiconductor packageQORVO US INC·Filed 2016·Granted May 9, 2017·3 cites·22 claims
- 0372US8680683B1Wafer level package with embedded passive components and method of manufacturingJUSKEY FRANK J·Filed 2010·Granted Mar 25, 2014·4 cites·11 claims
- 0469US9169536B2Process for providing noble metal-containing mixtures for recovering noble metalsZIMMERMANN KLAUS·Filed 2012·Granted Oct 27, 2015·2 cites·36 claims
- 0563US9935066B2Semiconductor package having a substrate structure with selective surface finishesQORVO US INC·Filed 2016·Granted Apr 3, 2018·1 cites·17 claims
- 0657US10607960B2Substrate structure with selective surface finishes for flip chip assemblyQORVO US INC·Filed 2019·Granted Mar 31, 2020·0 cites·21 claims
- 0752US10283480B2Substrate structure with selective surface finishes for flip chip assemblyQORVO US INC·Filed 2016·Granted May 7, 2019·0 cites·20 claims
- 0848US2014106511A1Flip-chip packaging techniques and configurationsTRIQUINT SEMICONDUCTOR INC·Filed 2013·Application pending·0 cites
- 0943US2013234344A1Flip-chip packaging techniques and configurationsJUSKEY FRANK J·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Robert Hartmann files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →