Inventor · disambiguated record
Jhun Hua Chen
Also filed as: CHEN JHUN HUA
13 granted patents·66 citations·filing 2006–2024
90Inventor score
Top patents by PatentIndex Score
13 records- 0195US9711367B1Semiconductor method with wafer edge modificationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 18, 2017·23 cites·20 claims
- 0293US11579539B2Method and apparatus for improving critical dimension variationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 14, 2023·3 cites·20 claims
- 0392US11988972B2Method and apparatus for improving critical dimension variationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 21, 2024·2 cites·20 claims
- 0489US9799567B2Method of forming source/drain contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 24, 2017·8 cites·20 claims
- 0588US7767570B2Dummy vias for damascene processTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Aug 3, 2010·15 cites·14 claims
- 0687US10163720B2Method of forming source/drain contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·4 cites·20 claims
- 0784US7960821B2Dummy vias for damascene processTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jun 14, 2011·6 cites·20 claims
- 0882US12379674B2Method and apparatus for improving critical dimension variationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 5, 2025·0 cites·20 claims
- 0971US7939222B2Method and system for improving printing accuracy of a contact layoutTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted May 10, 2011·3 cites·10 claims
- 1065US8580637B2Method of patterning a semiconductor device having improved spacing and shape control and a semiconductor deviceCHEN JHUN HUA·Filed 2011·Granted Nov 12, 2013·2 cites·20 claims
- 1158US10522413B2Method of forming source/drain contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·0 cites·20 claims
- 1255US9070688B2Method of patterning a semiconductor device having improved spacing and shape control and a semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 30, 2015·0 cites·20 claims
- 1342US9905471B2Integrated circuit structure and method forming trenches with different depthsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 27, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →