Inventor · disambiguated record
Keun-Hyuk Lee
Also filed as: LEE KEUN-HYUK
17 granted patents·1 pending application·310 citations·filing 2002–2014
94Inventor score
Technology areasH10W
Top patents by PatentIndex Score
18 records- 0196US7675148B2Power module having stacked flip-chip and method of fabricating the power moduleFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2008·Granted Mar 9, 2010·42 cites·21 claims
- 0294US7706146B2Power system module and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2007·Granted Apr 27, 2010·31 cites·18 claims
- 0394US6774465B2Semiconductor power package moduleFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2002·Granted Aug 10, 2004·123 cites·14 claims
- 0490US8258622B2Power device package and semiconductor package mold for fabricating the sameLEE KEUN-HYUK·Filed 2008·Granted Sep 4, 2012·23 cites·25 claims
- 0589US9130065B2Power module having stacked flip-chip and method for fabricating the power moduleFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2014·Granted Sep 8, 2015·8 cites·20 claims
- 0685US8013431B2Semiconductor power module package with temperature sensor mounted thereon and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2010·Granted Sep 6, 2011·7 cites·15 claims
- 0784US7659559B2Semiconductor package having insulated metal substrate and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2008·Granted Feb 9, 2010·10 cites·12 claims
- 0883US8125080B2Semiconductor power module packages with simplified structure and methods of fabricating the sameLEE KEUN-HYUK·Filed 2008·Granted Feb 28, 2012·13 cites·27 claims
- 0979US6710439B2Three-dimensional power semiconductor module and method of manufacturing the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2002·Granted Mar 23, 2004·28 cites·21 claims
- 1078US7986531B2Power system module and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2010·Granted Jul 26, 2011·4 cites·17 claims
- 1174US8350369B2High power semiconductor packageFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2008·Granted Jan 8, 2013·7 cites·43 claims
- 1274US7701048B2Power module for low thermal resistance and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2007·Granted Apr 20, 2010·5 cites·21 claims
- 1372US7842545B2Semiconductor package having insulated metal substrate and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2009·Granted Nov 30, 2010·4 cites·7 claims
- 1467US7871848B2Semiconductor power module package without temperature sensor mounted thereon and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2008·Granted Jan 18, 2011·3 cites·8 claims
- 1562US7951645B2Power module for low thermal resistance and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2010·Granted May 31, 2011·1 cites·8 claims
- 1658US7714428B2High power semiconductor package and method of making the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2007·Granted May 11, 2010·1 cites·16 claims
- 1747US7808103B2Leadless packageFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2009·Granted Oct 5, 2010·0 cites·18 claims
- 1843US2010140786A1Semiconductor power module package having external bonding areaFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →