Inventor · disambiguated record
Shrikant Lohokare
Also filed as: LOHOKARE SHRIKANT · LOHOKARE SHRIKANT P
12 granted patents·97 citations·filing 2003–2007
90Inventor score
Top patents by PatentIndex Score
12 records- 0192US7413673B2Method for adjusting voltage on a powered Faraday shieldLAM RES CORP·Filed 2005·Granted Aug 19, 2008·17 cites·13 claims
- 0284US7380982B2Accurate temperature measurement for semiconductor applicationsLAM RES CORP·Filed 2005·Granted Jun 3, 2008·11 cites·11 claims
- 0381US7217649B2System and method for stress free conductor removalLAM RES CORP·Filed 2004·Granted May 15, 2007·23 cites·12 claims
- 0471US6939796B2System, method and apparatus for improved global dual-damascene planarizationLAM RES CORP·Filed 2003·Granted Sep 6, 2005·14 cites·20 claims
- 0566US7140374B2System, method and apparatus for self-cleaning dry etchLAM RES CORP·Filed 2004·Granted Nov 28, 2006·8 cites·17 claims
- 0666US7129167B1Methods and systems for a stress-free cleaning a surface of a substrateLAM RES CORP·Filed 2004·Granted Oct 31, 2006·10 cites·16 claims
- 0763US8211238B2System, method and apparatus for self-cleaning dry etchBAILEY III ANDREW D·Filed 2006·Granted Jul 3, 2012·1 cites·16 claims
- 0859US6821899B2System, method and apparatus for improved local dual-damascene planarizationLAM RES CORP·Filed 2003·Granted Nov 23, 2004·6 cites·27 claims
- 0958US7232766B2System and method for surface reduction, passivation, corrosion prevention and activation of copper surfaceLAM RES CORP·Filed 2004·Granted Jun 19, 2007·6 cites·15 claims
- 1053US7959984B2Methods and arrangement for the reduction of byproduct deposition in a plasma processing systemLAM RES CORP·Filed 2004·Granted Jun 14, 2011·1 cites·44 claims
- 1151US8017516B2Method for stress free conductor removalLAM RES CORP·Filed 2007·Granted Sep 13, 2011·0 cites·13 claims
- 1239US8277675B2Method of damaged low-k dielectric film layer removalYUN SEOKMIN·Filed 2006·Granted Oct 2, 2012·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →