Inventor · disambiguated record
Gary E. Oberlin
Also filed as: OBERLIN GARY E · OBERLIN GARY EUGENE
8 granted patents·2 pending applications·331 citations·filing 1999–2007
89Inventor score
Top patents by PatentIndex Score
10 records- 0197US7551439B2Fluid cooled electronic assemblyDELPHI TECH INC·Filed 2006·Granted Jun 23, 2009·106 cites·17 claims
- 0296US7739791B2Method of producing an overmolded electronic module with a flexible circuit pigtailDELPHI TECH INC·Filed 2007·Granted Jun 22, 2010·55 cites·1 claims
- 0385US6999317B2Thermally enhanced electronic module with self-aligning heat sinkDELPHI TECH INC·Filed 2003·Granted Feb 14, 2006·43 cites·9 claims
- 0482US6262489B1Flip chip with backside electrical contact and assembly and method thereforDELPHI TECH INC·Filed 1999·Granted Jul 17, 2001·79 cites·19 claims
- 0571US7106588B2Power electronic system with passive coolingDELPHI TECH INC·Filed 2003·Granted Sep 12, 2006·18 cites·21 claims
- 0666US6559763B2Frontal impact characterization apparatus for a motor vehicle restraint systemDELPHI TECH INC·Filed 2001·Granted May 6, 2003·17 cites·12 claims
- 0763US6593527B1Integrated circuit assembly with bar bond attachmentDELPHI TECH INC·Filed 2002·Granted Jul 15, 2003·13 cites·19 claims
- 0838US7038308B2Multi-path bar bond connector for an integrated circuit assemblyDELPHI TECH INC·Filed 2004·Granted May 2, 2006·0 cites·11 claims
- 0938US2006221571A1Thermal conductor and use thereofOBERLIN GARY E·Filed 2005·Application pending·0 cites
- 1031US2005252681A1Microelectronic assembly having variable thickness solder jointRUNYON RONNIE J·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →