Inventor · disambiguated record
Yong Woon Yeo
Also filed as: YEO YONG WOON
5 granted patents·17 citations·filing 2004–2020
69Inventor score
Files withNEPES CO LTD5
Top patents by PatentIndex Score
5 records- 0178US10804146B2Method for producing semiconductor packageNEPES CO LTD·Filed 2019·Granted Oct 13, 2020·2 cites·20 claims
- 0273US7170170B2Bump for semiconductor package, semiconductor package applying the bump, and method for fabricating the semiconductor packageNEPES CO LTD·Filed 2004·Granted Jan 30, 2007·15 cites·24 claims
- 0349US11404347B2Semiconductor packageNEPES CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·17 claims
- 0442US12198997B2Semiconductor package comprising first molding layer and second molding layer with different thermal expansion coefficientsNEPES CO LTD·Filed 2019·Granted Jan 14, 2025·0 cites·13 claims
- 0537US11264330B2Chip package with connection portion that passes through an encapsulation portionNEPES CO LTD·Filed 2018·Granted Mar 1, 2022·0 cites·16 claims
Join the waitlist — get patent alerts
Get an alert when Yong Woon Yeo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →