Inventor · disambiguated record
Fumio Echigo
Also filed as: ECHIGO FUMIO
32 granted patents·9 pending applications·467 citations·filing 1991–2010
97Inventor score
Top patents by PatentIndex Score
41 records- 0195US6459046B1Printed circuit board and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Oct 1, 2002·86 cites·9 claims
- 0293US6799369B2Printed circuit board and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Oct 5, 2004·52 cites·9 claims
- 0390US6518514B2Circuit board and production of the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 11, 2003·48 cites·17 claims
- 0489US6753483B2Printed circuit board and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jun 22, 2004·36 cites·11 claims
- 0588US7956293B2Multilayer printed wiring board and manufacturing method thereofPANASONIC CORP·Filed 2007·Granted Jun 7, 2011·15 cites·7 claims
- 0688US6691409B2Method of producing a circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Feb 17, 2004·40 cites·9 claims
- 0784US6558780B2Circuit board and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 6, 2003·24 cites·11 claims
- 0880US6734375B2Circuit board having an interstitial inner via hole structureMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 11, 2004·22 cites·11 claims
- 0979US7132029B2Multilayer circuit board and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Nov 7, 2006·7 cites·34 claims
- 1078US8134082B2Solid printed circuit board and method of manufacturing the sameNAKAMURA TADASHI·Filed 2008·Granted Mar 13, 2012·9 cites·16 claims
- 1175US7045198B2Prepreg and circuit board and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted May 16, 2006·18 cites·12 claims
- 1275US6996902B2Method for manufacturing a circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Feb 14, 2006·14 cites·8 claims
- 1373US8395056B2Multilayer printed wiring board and mounting body using the sameNAKAMURA TADASHI·Filed 2009·Granted Mar 12, 2013·5 cites·16 claims
- 1471US7018705B2Multilayer circuit board and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Mar 28, 2006·12 cites·5 claims
- 1568US7103971B2Process for manufacturing a circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Sep 12, 2006·2 cites·4 claims
- 1662US6596381B2Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jul 22, 2003·6 cites·18 claims
- 1761US6756628B2Capacitor sheet with built in capacitorsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jun 29, 2004·8 cites·9 claims
- 1861US6546624B2Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Apr 15, 2003·8 cites·18 claims
- 1960US6745464B2Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 8, 2004·7 cites·8 claims
- 2057US7155820B2Method for manufacturing printed circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jan 2, 2007·5 cites·10 claims
- 2157US6916706B2Capacitor sheet, method for producing the same, board with built-in capacitors, and semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jul 12, 2005·6 cites·5 claims
- 2257US6713688B2Circuit board and its manufacture methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Mar 30, 2004·6 cites·12 claims
- 2355US5399407AMagnetic recording mediumMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Mar 21, 1995·10 cites·13 claims
- 2454US7174632B2Method of manufacturing a double-sided circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Feb 13, 2007·4 cites·5 claims
- 2553US7047629B2Method of manufacturing circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted May 23, 2006·4 cites·4 claims
- 2653US2006283626A1Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 2751US6694612B1Mask film having a non-parting portionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Feb 24, 2004·3 cites·29 claims
- 2851US6686029B2Circuit board and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Feb 3, 2004·2 cites·10 claims
- 2951US2011030207A1Multilayer printed wiring board and manufacturing method thereofPANASONIC CORP·Filed 2010·Application pending·0 cites
- 3046US2010230138A1Wiring boardASAHI TOSHIYUKI·Filed 2008·Application pending·0 cites
- 3146US2008121416A1Multilayer Printed Wiring Board And Manufacturing Method For SameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 3245US8076589B2Multilayer wiring board and its manufacturing methodNAKAMURA TADASHI·Filed 2006·Granted Dec 13, 2011·0 cites·18 claims
- 3345US7066344B2Mask film, its manufacturing method, and manufacturing method of circuit board using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 27, 2006·1 cites·19 claims
- 3443US6866892B2Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Mar 15, 2005·0 cites·3 claims
- 3543US2003045164A1Non-woven fabric material and prepreg, and circuit board using the sameFiled 2000·Application pending·0 cites
- 3642US2009229862A1Multilayer printed wiring board and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 3741US2005016764A1Wiring substrate for intermediate connection and multi-layered wiring board and their productionFiled 2004·Application pending·0 cites
- 3840US2004214006A1Member for a circuit board, method of manufacturing the same, and methods of manufacturing circuit boardsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Application pending·0 cites
- 3939US2003137815A1Printed wiring board and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Application pending·0 cites
- 4030US6037037AMagnetic recording mediumMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Mar 14, 2000·3 cites·9 claims
- 4130US5342668AMagnetic recording medium having improved electromagnetic conversion characteristics and durabilityMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1991·Granted Aug 30, 1994·4 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →