Inventor · disambiguated record
Soosan Park
Also filed as: PARK SOOSAN
3 granted patents·1 pending application·21 citations·filing 2011–2017
68Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0188US9859200B2Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2015·Granted Jan 2, 2018·8 cites·10 claims
- 0284US9312218B2Semiconductor device and method of forming leadframe with conductive bodies for vertical electrical interconnect of semiconductor dieCHOI DAESIK·Filed 2011·Granted Apr 12, 2016·8 cites·20 claims
- 0381US10418332B2Semiconductor device and method of forming partition fence and shielding layer around semiconductor componentsSTATS CHIPPAC PTE LTD·Filed 2017·Granted Sep 17, 2019·5 cites·22 claims
- 0433US2016190056A1Integrated circuit packaging system with package-on-package mechanism and method of manufacture thereofPARK SOOSAN·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →