Inventor · disambiguated record
Kyu-Pil Lee
Also filed as: LEE KYU OK · LEE KYU-PIL
22 granted patents·5 pending applications·455 citations·filing 1991–2018
96Inventor score
Top patents by PatentIndex Score
27 records- 0187US5959322AIsolated SOI memory structure with vertically formed transistor and storage capacitor in a substrateSAMSUNG ELECTRONICS CO LTD·Filed 1994·Granted Sep 28, 1999·59 cites·1 claims
- 0284US6200855B1Semiconductor memory device, and method for fabricating thereofSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Mar 13, 2001·51 cites·13 claims
- 0380US11251307B2Device comprising 2D materialSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 15, 2022·2 cites·20 claims
- 0479US9349724B2Semiconductor device having capacitorsSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted May 24, 2016·6 cites·19 claims
- 0579US5663092AMethods of fabricating a transistor cell with a high aspect ratio buried contactSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Sep 2, 1997·40 cites·20 claims
- 0674US6184079B1Method for fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Feb 6, 2001·31 cites·11 claims
- 0774US5936272ADRAM transistor cells with a self-aligned storage electrode contactSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Aug 10, 1999·32 cites·6 claims
- 0874US5748521AMetal plug capacitor structures for integrated circuit devices and related methodsSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted May 5, 1998·31 cites·13 claims
- 0973US5969395AIntegrated circuit memory devices with high and low dopant concentration regions of different diffusivitiesSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Oct 19, 1999·27 cites·19 claims
- 1073US5466628AMethod of manufacturing trench capacitor with a recessed field oxide layerSAMSUNG ELECTRONICS CO LTD·Filed 1994·Granted Nov 14, 1995·32 cites·29 claims
- 1170US10274519B2Wafer inspection equipment having laser cleaning functionIMT CO LTD·Filed 2015·Granted Apr 30, 2019·2 cites·18 claims
- 1266US5324680ASemiconductor memory device and the fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 1992·Granted Jun 28, 1994·25 cites·10 claims
- 1362US6074918AMethods of fabrication DRAM transistor cells with a self-aligned storage electrode contactSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Jun 13, 2000·18 cites·27 claims
- 1460US6218272B1Method for fabricating conductive padSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Apr 17, 2001·20 cites·17 claims
- 1554US6703306B2Methods of fabricating integrated circuit memories including titanium nitride bit linesSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Mar 9, 2004·10 cites·7 claims
- 1654US6242809B1Integrated circuit memory devices including titanium nitride bit linesSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jun 5, 2001·16 cites·3 claims
- 1751US6306719B1Method for manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Oct 23, 2001·11 cites·3 claims
- 1849US6156636AMethod of manufacturing a semiconductor device having self-aligned contact holesSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Dec 5, 2000·16 cites·8 claims
- 1949US5208470ASemiconductor memory device with a stacked capacitorSAMSUNG ELECTRONICS CO LTD·Filed 1991·Granted May 4, 1993·14 cites·13 claims
- 2048US10776365B2Method and apparatus for calculating similarity of life log dataUNIV AJOU IND ACADEMIC COOP FOUND·Filed 2017·Granted Sep 15, 2020·0 cites·14 claims
- 2144US6162672AMethod for forming integrated circuit memory devices with high and low dopant concentration regions of different diffusivitiesSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Dec 19, 2000·6 cites·12 claims
- 2243US2017140951A1Three-dimensional wafer surface washing method and deviceIMT CO LTD·Filed 2014·Application pending·0 cites
- 2343US2016372317A1Device and method for cleaning backside or edge of waferIMT CO LTD·Filed 2014·Application pending·0 cites
- 2440US2007030871A1Semiconductor device having low resistance contact to p-type semiconductor layer of a wide band gap compound and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2537US2013140265A1Methods of forming pattern structures and methods of forming capacitors using the sameKIM CHEON-BAE·Filed 2012·Application pending·0 cites
- 2634US5508564ASemiconductor device having an improved packing density and high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 1994·Granted Apr 16, 1996·6 cites·16 claims
- 2731US2004231600A1Wafer carrier locking deviceFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →