Inventor · disambiguated record
Frank Y. Lin
Also filed as: LIN FRANK · LIN FRANK Y · LIN FRANK YUN
16 granted patents·3 pending applications·215 citations·filing 2000–2021
93Inventor score
Top patents by PatentIndex Score
19 records- 0195US6441555B1Plasma excitation coilLAM RES CORP·Filed 2000·Granted Aug 27, 2002·53 cites·39 claims
- 0292US6646385B2Plasma excitation coilLAM RES CORP·Filed 2002·Granted Nov 11, 2003·38 cites·51 claims
- 0385US6514378B1Method for improving uniformity and reducing etch rate variation of etching polysiliconLAM RES CORP·Filed 2000·Granted Feb 4, 2003·36 cites·20 claims
- 0483US7491343B2Line end shortening reduction during etchLAM RES CORP·Filed 2007·Granted Feb 17, 2009·10 cites·17 claims
- 0583US6617257B2Method of plasma etching organic antireflective coatingLAM RES CORP·Filed 2001·Granted Sep 9, 2003·35 cites·20 claims
- 0681US9865472B2Fabrication of a silicon structure and deep silicon etch with profile controlLAM RES CORP·Filed 2016·Granted Jan 9, 2018·3 cites·13 claims
- 0781US6531029B1Vacuum plasma processor apparatus and methodLAM RES CORP·Filed 2000·Granted Mar 11, 2003·15 cites·33 claims
- 0875US9330926B2Fabrication of a silicon structure and deep silicon etch with profile controlCHEBI ROBERT·Filed 2008·Granted May 3, 2016·7 cites·32 claims
- 0971US8480913B2Plasma processing method and apparatus with control of plasma excitation powerNI TUQIANG·Filed 2011·Granted Jul 9, 2013·2 cites·50 claims
- 1069US7682980B2Method to improve profile control and N/P loading in dual doped gate applicationsLAM RES CORP·Filed 2007·Granted Mar 23, 2010·3 cites·10 claims
- 1166US8871105B2Method for achieving smooth side walls after Bosch etch processWINNICZEK JAROSLAW W·Filed 2012·Granted Oct 28, 2014·2 cites·19 claims
- 1266US7407597B2Line end shortening reduction during etchLAM RES CORP·Filed 2006·Granted Aug 5, 2008·2 cites·17 claims
- 1360US8668805B2Line end shortening reduction during etchKOTA GOWRI·Filed 2008·Granted Mar 11, 2014·2 cites·7 claims
- 1458US7186661B2Method to improve profile control and N/P loading in dual doped gate applicationsLAM RES CORP·Filed 2003·Granted Mar 6, 2007·6 cites·3 claims
- 1551US2022108875A1Multi-location gas injection to improve uniformity in rapid alternating processesLAM RES CORP·Filed 2020·Application pending·0 cites
- 1650US6897156B2Vacuum plasma processor methodLAM RES CORP·Filed 2003·Granted May 24, 2005·1 cites·24 claims
- 1749US2023223292A1Flat bottom shadow ringLAM RES CORP·Filed 2021·Application pending·0 cites
- 1841US2002139477A1Plasma processing method and apparatus with control of plasma excitation powerLAM RES CORP·Filed 2001·Application pending·0 cites
- 1940US8609548B2Method for providing high etch rateXU QING·Filed 2011·Granted Dec 17, 2013·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →