Inventor · disambiguated record
Mei-Hui Fu
Also filed as: FU MEI-HUI
12 granted patents·2 pending applications·519 citations·filing 2014–2024
89Inventor score
Top patents by PatentIndex Score
14 records- 0198US9831183B2Contact structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 28, 2017·493 cites·20 claims
- 0295US10847411B2Conductive feature formation and structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 24, 2020·12 cites·20 claims
- 0389US10756017B2Contact structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 25, 2020·4 cites·20 claims
- 0485US9589892B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 7, 2017·4 cites·20 claims
- 0583US10475702B2Conductive feature formation and structure using bottom-up filling depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 12, 2019·2 cites·20 claims
- 0683US2024379433A1Conductive feature formation and structure using bottom-up filling depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0780US9385080B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 5, 2016·4 cites·20 claims
- 0873US12482705B2Conductive feature formation and structure using bottom-up filling depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 25, 2025·0 cites·20 claims
- 0968US11532503B2Conductive feature structure including a blocking regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·0 cites·20 claims
- 1066US10943823B2Conductive feature formation and structure using bottom-up filling depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 9, 2021·0 cites·20 claims
- 1157US10269713B2Contact structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·0 cites·20 claims
- 1256US10804140B2Interconnect formation and structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 13, 2020·0 cites·21 claims
- 1354US2022375863A1Semiconductor arrangement and method for makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1448US11482495B2Semiconductor arrangement and method for makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 25, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →