Inventor · disambiguated record
Takekazu Tanaka
Also filed as: TANAKA TAKEKAZU
14 granted patents·1 pending application·60 citations·filing 2002–2012
90Inventor score
Technology areasH10W
Top patents by PatentIndex Score
15 records- 0185US8395261B2Semiconductor deviceTANAKA TAKEKAZU·Filed 2012·Granted Mar 12, 2013·6 cites·13 claims
- 0280US7449370B2Production process for manufacturing such semiconductor packageNEC ELECTRONICS CORP·Filed 2006·Granted Nov 11, 2008·9 cites·9 claims
- 0374US7791198B2Semiconductor device including a coupling region which includes layers of aluminum and copper alloysNEC ELECTRONICS CORP·Filed 2008·Granted Sep 7, 2010·4 cites·21 claims
- 0473US8299620B2Semiconductor device with welded leads and method of manufacturing the sameTANAKA TAKEKAZU·Filed 2008·Granted Oct 30, 2012·6 cites·2 claims
- 0573US7138673B2Semiconductor package having encapsulated chip attached to a mounting plateNEC ELECTRONICS CORP·Filed 2003·Granted Nov 21, 2006·19 cites·17 claims
- 0665US7772031B2Semiconductor apparatus manufacturing methodNEC ELECTRONICS CORP·Filed 2007·Granted Aug 10, 2010·3 cites·18 claims
- 0758US7550829B2Electronic package and semiconductor device using the sameNEC ELECTRONICS CORP·Filed 2007·Granted Jun 23, 2009·1 cites·13 claims
- 0858US7274090B2Electronic package and semiconductor device using the sameNEC ELECTRONICS CORP·Filed 2005·Granted Sep 25, 2007·1 cites·24 claims
- 0955US7224045B2Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor packageNEC ELECTRONICS CORP·Filed 2004·Granted May 29, 2007·8 cites·18 claims
- 1050US8334596B2Semiconductor device including coupling ball with layers of aluminum and copper alloysTANAKA TAKEKAZU·Filed 2011·Granted Dec 18, 2012·0 cites·20 claims
- 1150US7944052B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted May 17, 2011·0 cites·12 claims
- 1248US7189599B2Lead frame, semiconductor device using the same and method of producing the semiconductor deviceNEC ELECTRONICS CORP·Filed 2004·Granted Mar 13, 2007·3 cites·5 claims
- 1345US7820489B2Method of manufacturing semiconductor apparatusNEC ELECTRONICS CORP·Filed 2007·Granted Oct 26, 2010·0 cites·14 claims
- 1441US7723837B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2006·Granted May 25, 2010·0 cites·20 claims
- 1537US2002180011A1Lead frame, semiconductor device using the same and method of producing the semiconductor deviceNEC CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →