Inventor · disambiguated record
Szutsun S. Ou
Also filed as: OU SZUTSUN S · OU SZUTSUN SIMON
7 granted patents·6 pending applications·110 citations·filing 1988–2025
85Inventor score
Top patents by PatentIndex Score
13 records- 0171US5253263AHigh-power surface-emitting semiconductor injection laser with etched internal 45 degree and 90 degree micromirrorsTRW INC·Filed 1992·Granted Oct 12, 1993·30 cites·16 claims
- 0262US5298762AQuantum well switching device with stimulated emission capabilitiesTRW INC·Filed 1992·Granted Mar 29, 1994·26 cites·23 claims
- 0360US4896195ASuperluminescent diodeTRW INC·Filed 1988·Granted Jan 23, 1990·18 cites·13 claims
- 0460US2025367759A1Laser process to enhance the wire bonding processTURNING POINT LASERS CORP·Filed 2025·Application pending·0 cites
- 0552US5311020AMonolithically-integrated semiconductor/superconductor infrared detector and readout circuitTRW INC·Filed 1992·Granted May 10, 1994·19 cites·10 claims
- 0652US5025451ATwo-dimensional integrated laser arrayTRW INC·Filed 1989·Granted Jun 18, 1991·9 cites·16 claims
- 0749US2025323471A1Tunable narrow spectral width high power semiconductor laser systemTURNING POINT LASERS CORP·Filed 2025·Application pending·0 cites
- 0847US11888285B2Low numerical aperture fiber output diode laser moduleTURNING POINT LASERS CORP·Filed 2021·Granted Jan 30, 2024·0 cites·9 claims
- 0942US2024198451A1Fiber output hybrid laser systemTURNING POINT LASERS CORP·Filed 2022·Application pending·0 cites
- 1040US2007247728A1Optical unit of a laser moduleLIN CLARK·Filed 2007·Application pending·0 cites
- 1136US2012082176A1Conduction cooled package laser and packaging method for forming the sameOU SZUTSUN SIMON·Filed 2011·Application pending·0 cites
- 1234US6057563ALight transparent superlattice window layer for light emitting diodeLITE ON ELECTONICS INC·Filed 1998·Granted May 2, 2000·8 cites·4 claims
- 1332US2006284305A1Packaging base for semiconductor elementsYEN HSIEN-CHENG·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →