Inventor · disambiguated record
Candy Tien
Also filed as: TIEN CANDY
3 granted patents·350 citations·filing 1999–2002
78Inventor score
Technology areasH10W
Files withSILICONWARE PRECISION INDUSTRIES CO LTD3
Top patents by PatentIndex Score
3 records- 0192US6246115B1Semiconductor package having a heat sink with an exposed surfaceSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Jun 12, 2001·170 cites·14 claims
- 0290US6552428B1Semiconductor package having an exposed heat spreaderSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Apr 22, 2003·168 cites·14 claims
- 0359US6650015B2Cavity-down ball grid array package with semiconductor chip solder ballSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Nov 18, 2003·12 cites·10 claims
Join the waitlist — get patent alerts
Get an alert when Candy Tien files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →