Inventor · disambiguated record
Ting-Ke Chai
Also filed as: CHAI TING-KE
3 granted patents·76 citations·filing 2000–2002
74Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD3
Top patents by PatentIndex Score
3 records- 0180US6359342B1Flip-chip bumping structure with dedicated test pads on semiconductor chip and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Mar 19, 2002·37 cites·10 claims
- 0277US6555924B2Semiconductor package with flash preventing mechanism and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Apr 29, 2003·27 cites·16 claims
- 0359US6650015B2Cavity-down ball grid array package with semiconductor chip solder ballSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Nov 18, 2003·12 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →