Inventor · disambiguated record
Okgyeong Park
Also filed as: PARK OKGYEONG
1 granted patent·7 pending applications·9 citations·filing 2013–2024
32Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD8
Top patents by PatentIndex Score
8 records- 0178US8922024B2Semiconductor packages including molding layersSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 30, 2014·9 cites·15 claims
- 0255US2025029886A1Semiconductor package including thermal interfacial material patternsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0354US2025046755A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0451US2024413096A1Semiconductor package comprising stiffener structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0550US2025365996A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0647US2024324094A1Printed circuit boards and semiconductor packages having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0747US2024321753A1Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0846US2024222309A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →